EP3SE260H780C3N vs EP3SE260H780C4N 比較
詳細並排比較 EP3SE260H780C3N 由 Intel 與 EP3SE260H780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C3N | EP3SE260H780C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Series | Stratix® III E | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | — |
| Number of Pins / Balls | 780 | — |
| 封裝 | 780-BBGA, FCBGA (H780) | 780-ball FCBGA (Flip Chip BGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0 °C to +85 °C (C grade, commercial) | 0C to +85C (commercial) |
| Process Technology | 40 nm CMOS | — |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | — |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | — |
| RoHS 狀態 | Compliant (lead-free 'N' suffix) | — |
| 濕度敏感等級 (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | 3 (168 hours) |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | Serial/Parallel via Quartus II |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Family | — | Stratix III E (Enhanced) |
| Logic Elements | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Core Voltage | — | 0.86 V to 1.15 V |
| Maximum Core Clock Frequency | — | 450 MHz |