EP3SE260H780C4N vs EP3SE260H780I4 Perbandingan
Perbandingan bersamaan detil EP3SE260H780C4N dari Intel dan EP3SE260H780I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C4N | EP3SE260H780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Paket | 780-ball FCBGA (Flip Chip BGA) | 780-ball FC-HFBGA (HBGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 (168 hours) | — |
| Suhu Kerja | 0C to +85C (commercial) | -40C to +100C (industrial, 'I' grade) |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Speed Grade | — | 4 |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |