EP3SE260H780C4N vs EP3SE260H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4N sa pamamagitan ng Intel at EP3SE260H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C4N | EP3SE260H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Packhaging | 780-ball FCBGA (Flip Chip BGA) | 780-ball FC-HFBGA (HBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 hours) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (industrial, 'I' grade) |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Speed Grade | — | 4 |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |