EP3SE260H780C4N vs EP3SE260H780I4 比較

詳細並排比較 EP3SE260H780C4N 由 Intel 與 EP3SE260H780I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260H780C4N EP3SE260H780I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E (Enhanced) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Total RAM Bits 16,672,768 —
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS —
Core Voltage 0.86 V to 1.15 V 1.1 V
Maximum Core Clock Frequency 450 MHz —
封裝 780-ball FCBGA (Flip Chip BGA) 780-ball FC-HFBGA (HBGA)
安裝類型 Surface Mount Surface Mount (BGA)
濕度敏感等級 (MSL) 3 (168 hours) —
工作溫度 0C to +85C (commercial) -40C to +100C (industrial, 'I' grade)
Configuration Method Serial/Parallel via Quartus II —
Logic Cells — 255,000
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Process Technology — 65 nm CMOS
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Maximum Operating Frequency — up to 450 MHz core / 717 MHz per Partstack record
Speed Grade — 4
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial
RoHS 狀態 — [DATA_NEEDED: RoHS compliance status]

資料表與資源

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