EP3SL200H780C2 vs EP3SL200H780C3N Perbandingan
Perbandingan bersamaan detil EP3SL200H780C2 dari Intel dan EP3SL200H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C2 | EP3SL200H780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Logic Elements | 200,000 | 200,000 |
| LABs / CLBs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | — |
| Paket | 780-BBGA, FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Suhu Kerja | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | 3 |
| Process Node | 65 nm | 40 nm |
| Voltage - Core | [DATA_NEEDED: core voltage] | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | [DATA_NEEDED: I/O voltage] | 1.2 V to 3.3 V (VCCIO banks) |
| DSP Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | [DATA_NEEDED: transceiver count for H780] | 24 channels, up to 3.75 Gbps |
| Status RoHS | Compliant | — |
| Lead Free | Yes | — |
| Family | — | Stratix III L (low-power) |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |