EP3SL200H780C2 vs EP3SL200H780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2 sa pamamagitan ng Intel at EP3SL200H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2 | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | — |
| Logic Elements | 200,000 | 200,000 |
| LABs / CLBs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | — |
| Packhaging | 780-BBGA, FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 |
| Process Node | 65 nm | 40 nm |
| Voltage - Core | [DATA_NEEDED: core voltage] | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | [DATA_NEEDED: I/O voltage] | 1.2 V to 3.3 V (VCCIO banks) |
| DSP Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | [DATA_NEEDED: transceiver count for H780] | 24 channels, up to 3.75 Gbps |
| Tindminan RoHS | Compliant | — |
| Lead Free | Yes | — |
| Family | — | Stratix III L (low-power) |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |