EP3SL200H780I3N vs EP3SL200H780C3N Perbandingan

Perbandingan bersamaan detil EP3SL200H780I3N dari Intel dan EP3SL200H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I3N EP3SL200H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III L Stratix III L (low-power)
Logic Elements 200,000 200,000
RAM Bits 10,901,504 —
User I/O 488 —
Paket 780-BBGA, FCBGA 780-Ball FCBGA (HBGA), 29 x 29 mm
Package Pin Count 780 —
Tipe Mounting Surface Mount Surface Mount
Suhu Kerja -40C to +100C (Industrial) 0C to +85C (commercial)
Supply Voltage (Core) 0.9 V —
Technology CMOS, 40 nm —
Process Node 40 nm 40 nm
Number of Terminals 780 —
Case / Package Code BGA-780 —
Status RoHS Compliant —
Lead-Free Yes —
Embedded Memory Bits — 10,901,504 bits
Logic Array Blocks (LABs) — 8,000
User I/Os — 488
Maximum Internal Clock Frequency — 800 MHz
Transceivers — 24 channels, up to 3.75 Gbps
DSP Blocks — 384
Speed Grade — C3 (commercial, -3 speed)
Voltage - Core — 0.9 V / 1.0 V (core, VCC)
Voltage - I/O — 1.2 V to 3.3 V (VCCIO banks)
Level MSL — 3
Lead-Free / RoHS — Yes
Mounting Pitch — 1.0 mm ball pitch
PLLs — 12 (Stratix III PLL array)
Configuration — JTAG IEEE Std 1149.1, passive/active serial

Spek dan Sumber

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