EP3SL200H780I3N vs EP3SL200H780C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I3N sa pamamagitan ng Intel at EP3SL200H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL200H780I3N EP3SL200H780C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Stratix III L Stratix III L (low-power)
Logic Elements 200,000 200,000
RAM Bits 10,901,504 —
User I/O 488 —
Packhaging 780-BBGA, FCBGA 780-Ball FCBGA (HBGA), 29 x 29 mm
Package Pin Count 780 —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon -40C to +100C (Industrial) 0C to +85C (commercial)
Supply Voltage (Core) 0.9 V —
Technology CMOS, 40 nm —
Process Node 40 nm 40 nm
Number of Terminals 780 —
Case / Package Code BGA-780 —
Tindminan RoHS Compliant —
Lead-Free Yes —
Embedded Memory Bits — 10,901,504 bits
Logic Array Blocks (LABs) — 8,000
User I/Os — 488
Maximum Internal Clock Frequency — 800 MHz
Transceivers — 24 channels, up to 3.75 Gbps
DSP Blocks — 384
Speed Grade — C3 (commercial, -3 speed)
Voltage - Core — 0.9 V / 1.0 V (core, VCC)
Voltage - I/O — 1.2 V to 3.3 V (VCCIO banks)
Level ng MSL — 3
Lead-Free / RoHS — Yes
Mounting Pitch — 1.0 mm ball pitch
PLLs — 12 (Stratix III PLL array)
Configuration — JTAG IEEE Std 1149.1, passive/active serial

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