EP3SL200H780I3N vs EP3SL200H780C3N 比較

詳細並排比較 EP3SL200H780I3N 由 Intel 與 EP3SL200H780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL200H780I3N EP3SL200H780C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III L Stratix III L (low-power)
Logic Elements 200,000 200,000
RAM Bits 10,901,504 —
User I/O 488 —
封裝 780-BBGA, FCBGA 780-Ball FCBGA (HBGA), 29 x 29 mm
Package Pin Count 780 —
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +100C (Industrial) 0C to +85C (commercial)
Supply Voltage (Core) 0.9 V —
Technology CMOS, 40 nm —
Process Node 40 nm 40 nm
Number of Terminals 780 —
Case / Package Code BGA-780 —
RoHS 狀態 Compliant —
Lead-Free Yes —
Embedded Memory Bits — 10,901,504 bits
Logic Array Blocks (LABs) — 8,000
User I/Os — 488
Maximum Internal Clock Frequency — 800 MHz
Transceivers — 24 channels, up to 3.75 Gbps
DSP Blocks — 384
Speed Grade — C3 (commercial, -3 speed)
Voltage - Core — 0.9 V / 1.0 V (core, VCC)
Voltage - I/O — 1.2 V to 3.3 V (VCCIO banks)
MSL 等級 — 3
Lead-Free / RoHS — Yes
Mounting Pitch — 1.0 mm ball pitch
PLLs — 12 (Stratix III PLL array)
Configuration — JTAG IEEE Std 1149.1, passive/active serial

資料表與資源

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