EP3SL200H780I4N vs EP3SL200H780I4LN Perbandingan

Perbandingan bersamaan detil EP3SL200H780I4N dari Intel dan EP3SL200H780I4LN dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I4N EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Series Stratix III L Stratix III L
Family Stratix III (Logic-rich variant) Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (bits) 10,901,504 —
User I/Os 488 —
Core Voltage 1.1 V (0.86 V to 1.15 V range) —
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz —
Speed Grade I4 I4 (Industrial, mid-speed grade)
Rentang Suhu Kerja -40C to +100C (industrial) —
Paket 780-ball FCBGA (Flip-Chip BGA, FineLine) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Lead-Free Yes (suffix N) —
Status RoHS Compliant RoHS Compliant (lead-free)
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Suhu Kerja — -40C to +100C (industrial)
Paket / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Level MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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