EP3SL200H780I4N vs EP3SL200H780I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4N sa pamamagitan ng Intel at EP3SL200H780I4LN sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL200H780I4N | EP3SL200H780I4LN |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III (Logic-rich variant) | Stratix III L (Low-Power) |
| Logic Elements | 200,000 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | — |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | I4 (Industrial, mid-speed grade) |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA, FineLine) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| Tindminan RoHS | Compliant | RoHS Compliant (lead-free) |
| Manufacturer | — | Intel / Altera (now Intel PSG) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Level ng MSL | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |