EP3SL200H780I4N vs EP3SL200H780I4LN 比較

詳細並排比較 EP3SL200H780I4N 由 Intel 與 EP3SL200H780I4LN 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ 最後購買機會

規格比較

參數 EP3SL200H780I4N EP3SL200H780I4LN
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Series Stratix III L Stratix III L
Family Stratix III (Logic-rich variant) Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (bits) 10,901,504 —
User I/Os 488 —
Core Voltage 1.1 V (0.86 V to 1.15 V range) —
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz —
Speed Grade I4 I4 (Industrial, mid-speed grade)
工作溫度範圍 -40C to +100C (industrial) —
封裝 780-ball FCBGA (Flip-Chip BGA, FineLine) —
安裝類型 Surface Mount (BGA) Surface Mount
Lead-Free Yes (suffix N) —
RoHS 狀態 Compliant RoHS Compliant (lead-free)
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
工作溫度 — -40C to +100C (industrial)
封裝 / 外殼 — 780-BBGA, FCBGA (Flip-Chip BGA)
MSL 等級 — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

資料表與資源

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