EP3SL200H780I4N vs EP3SL200H780I4LN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I4N disebabkan oleh Intel dan EP3SL200H780I4LN disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL200H780I4N EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Series Stratix III L Stratix III L
Family Stratix III (Logic-rich variant) Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (bits) 10,901,504 —
User I/Os 488 —
Core Voltage 1.1 V (0.86 V to 1.15 V range) —
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz —
Speed Grade I4 I4 (Industrial, mid-speed grade)
Gambaran Suhu Operasi -40C to +100C (industrial) —
Kemasan 780-ball FCBGA (Flip-Chip BGA, FineLine) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Lead-Free Yes (suffix N) —
Status RoHS Compliant RoHS Compliant (lead-free)
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Suhu Operasi — -40C to +100C (industrial)
Kemasan / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Aras MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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