EP3SL50F780C2 vs EP3SL50F780C3 Perbandingan
Perbandingan bersamaan detil EP3SL50F780C2 dari Intel dan EP3SL50F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SL50F780C2 | EP3SL50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory (bits) | 2,184,192 | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Paket | 780-ball FCBGA (Flip-Chip BGA) | — |
| Suhu Kerja | 0°C to +85°C (commercial) | 0C to +85C (Commercial) |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | — |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| User I/Os | — | 488 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Configuration Method | — | SRAM-based, supports Partial Reconfiguration |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| Tingkat Sensitivitas Kekeringan (MSL) | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |