EP3SL50F780C2 vs EP3SL50F780C3 比較

詳細並排比較 EP3SL50F780C2 由 Intel 與 EP3SL50F780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL50F780C2 EP3SL50F780C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 最後購買
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (bits) 2,184,192 —
Maximum User I/Os 488 —
Core Voltage 1.1 V —
Process Technology 65 nm —
封裝 780-ball FCBGA (Flip-Chip BGA) —
工作溫度 0°C to +85°C (commercial) 0C to +85C (Commercial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
RoHS 狀態 Compliant Compliant
安裝類型 Surface Mount (BGA) —
Series — Stratix III
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
濕度敏感等級 (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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