EP3SL50F780C2 vs EP3SL50F780C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C2 sa pamamagitan ng Intel at EP3SL50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780C2 EP3SL50F780C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (bits) 2,184,192 —
Maximum User I/Os 488 —
Core Voltage 1.1 V —
Process Technology 65 nm —
Packhaging 780-ball FCBGA (Flip-Chip BGA) —
Temperature na Operasyon 0°C to +85°C (commercial) 0C to +85C (Commercial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount (BGA) —
Series — Stratix III
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Level ng Sensitivity sa Asid ng Moisture (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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