EP3SL70F780C3 vs EP3SL50F780C3 Perbandingan
Perbandingan bersamaan detil EP3SL70F780C3 dari Intel dan EP3SL50F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SL70F780C3 | EP3SL50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Series | Stratix III L | Stratix III |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements (LE) | 67,500 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Number of Pins / Balls | 780 | — |
| Paket | 780-BBGA, FC-FBGA | — |
| Tipe Mounting | Surface Mount | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Maximum Internal Clock Frequency | 500 MHz | — |
| Rentang Suhu Kerja | 0°C to 85°C (commercial) | — |
| Speed Grade | C3 | 3 |
| Design Software | Quartus II (last supported v13.1) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements | — | 47,500 |
| Embedded Memory Bits | — | 2,184,192 |
| User I/Os | — | 488 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Configuration Method | — | SRAM-based, supports Partial Reconfiguration |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| Tingkat Sensitivitas Kekeringan (MSL) | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |