EP3SL70F780C3 vs EP3SL50F780C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C3 disebabkan oleh Intel dan EP3SL50F780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL50F780C3 EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F780C3 EP3SL50F780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix III L Stratix III
Family Stratix III Stratix III L (low-power)
Logic Elements (LE) 67,500 —
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 1,900
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
Kemasan 780-BBGA, FC-FBGA —
Jenis Pemasangan Surface Mount —
Process Technology 65 nm —
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
Gambaran Suhu Operasi 0°C to 85°C (commercial) —
Speed Grade C3 3
Design Software Quartus II (last supported v13.1) —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Suhu Operasi — 0C to +85C (Commercial)
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Tingkat sensitiviti Air Nama (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga