EP3SL70F780C3 vs EP3SL50F780C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C3 sa pamamagitan ng Intel at EP3SL50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F780C3 EP3SL50F780C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III L Stratix III
Family Stratix III Stratix III L (low-power)
Logic Elements (LE) 67,500 —
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 1,900
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
Packhaging 780-BBGA, FC-FBGA —
Uri ng Pagpapasok Surface Mount —
Process Technology 65 nm —
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
Hanay ng Temperature na Operasyon 0°C to 85°C (commercial) —
Speed Grade C3 3
Design Software Quartus II (last supported v13.1) —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Temperature na Operasyon — 0C to +85C (Commercial)
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Level ng Sensitivity sa Asid ng Moisture (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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