EPM570FGF256I5N vs EPM570F256C3N Perbandingan
Perbandingan bersamaan detil EPM570FGF256I5N dari Intel dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570FGF256I5N | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 570 | 570 |
| Macrocells | 440 | — |
| Propagation Delay (tPD) | 5.0 ns | — |
| User I/O Pins (max) | 212 | — |
| Paket | 256-ball FBGA (FGF256) | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron | 0.18 um, 6-layer-metal flash CMOS |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Tegangan Pemuat | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 (fast) | — |
| Suhu Kerja | -40C to +100C | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level not stated in provided data] |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |