EPM570FGF256I5N vs EPM570F256C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570FGF256I5N disebabkan oleh Intel dan EPM570F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570FGF256I5N | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 570 | 570 |
| Macrocells | 440 | — |
| Propagation Delay (tPD) | 5.0 ns | — |
| User I/O Pins (max) | 212 | — |
| Kemasan | 256-ball FBGA (FGF256) | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron | 0.18 um, 6-layer-metal flash CMOS |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Tegangan Pemberi Arus | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 (fast) | — |
| Suhu Operasi | -40C to +100C | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level not stated in provided data] |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |