IRFS7440TRLPBF vs IRFS4321TRLPBF Perbandingan
Perbandingan bersamaan detil IRFS7440TRLPBF dari Infineon dan IRFS4321TRLPBF dari Infineon. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | IRFS7440TRLPBF | IRFS4321TRLPBF |
|---|---|---|
| Merek | Infineon | Infineon |
| Kategori | MOSFETs | MOSFETs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Infineon Technologies | — |
| Series | StrongIRFET | — |
| FET Type | N-Channel | N-Channel MOSFET, Metal Oxide |
| Technology | MOSFET (Metal Oxide Semiconductor) | IR HEXFET (IR MOSFET) |
| Drain-to-Source Voltage (VDS) | 40 V | 150 V |
| Continuous Drain Current (ID) at Tc=25C | 120 A | 85 A |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | [DATA_NEEDED: pulsed drain current] |
| Power Dissipation (PD) at Tc=25C | 208 W | 350 W |
| On-Resistance (RDS(on)) max at VGS=10V | 2.5 mOhm | — |
| Gate-Source Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical] | — |
| Total Gate Charge (Qg) | 90 nC (typical) | — |
| Gate Drive Voltage (optimized) | 10 V (normal level) | — |
| Operating Frequency Range (optimized) | <100 kHz | — |
| Paket | TO-263 (D2PAK), surface mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | [DATA_NEEDED: junction temperature range] | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Qualification | JEDEC standard | — |
| Continuous Drain Current (ID) at Tc=100C | — | [DATA_NEEDED: ID at Tc=100C] |
| RDS(on) Max at VGS=10V | — | 15 mOhm |
| RDS(on) Max at VGS=4.5V | — | [DATA_NEEDED: RDS(on) at VGS=4.5V] |
| Gate-to-Source Voltage (VGS) Max | — | ±20 V |
| Gate Threshold Voltage (VGS(th)) Typ | — | [DATA_NEEDED: VGS(th) typical] |
| Total Gate Charge (Qg) Typ | — | 71 nC |
| Total Gate Charge (Qg) Max | — | 110 nC |
| Thermal Resistance Junction-to-Case (RθJC) Max | — | 0.45 C/W |
| Thermal Resistance Junction-to-Case (RθJC) End-of-Life | — | 0.65 C/W (after 1000 cycles -55C to +150C) |
| Suhu Hubung Kerja | — | -55C to +175C |