IRFS7440TRLPBF vs IRFS4321TRLPBF Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci IRFS7440TRLPBF disebabkan oleh Infineon dan IRFS4321TRLPBF disebabkan oleh Infineon. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | IRFS7440TRLPBF | IRFS4321TRLPBF |
|---|---|---|
| Merek | Infineon | Infineon |
| Kategori | MOSFETs | MOSFETs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Infineon Technologies | — |
| Series | StrongIRFET | — |
| FET Type | N-Channel | N-Channel MOSFET, Metal Oxide |
| Technology | MOSFET (Metal Oxide Semiconductor) | IR HEXFET (IR MOSFET) |
| Drain-to-Source Voltage (VDS) | 40 V | 150 V |
| Continuous Drain Current (ID) at Tc=25C | 120 A | 85 A |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | [DATA_NEEDED: pulsed drain current] |
| Power Dissipation (PD) at Tc=25C | 208 W | 350 W |
| On-Resistance (RDS(on)) max at VGS=10V | 2.5 mOhm | — |
| Gate-Source Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical] | — |
| Total Gate Charge (Qg) | 90 nC (typical) | — |
| Gate Drive Voltage (optimized) | 10 V (normal level) | — |
| Operating Frequency Range (optimized) | <100 kHz | — |
| Kemasan | TO-263 (D2PAK), surface mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Gambaran Suhu Operasi | [DATA_NEEDED: junction temperature range] | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Qualification | JEDEC standard | — |
| Continuous Drain Current (ID) at Tc=100C | — | [DATA_NEEDED: ID at Tc=100C] |
| RDS(on) Max at VGS=10V | — | 15 mOhm |
| RDS(on) Max at VGS=4.5V | — | [DATA_NEEDED: RDS(on) at VGS=4.5V] |
| Gate-to-Source Voltage (VGS) Max | — | ±20 V |
| Gate Threshold Voltage (VGS(th)) Typ | — | [DATA_NEEDED: VGS(th) typical] |
| Total Gate Charge (Qg) Typ | — | 71 nC |
| Total Gate Charge (Qg) Max | — | 110 nC |
| Thermal Resistance Junction-to-Case (RθJC) Max | — | 0.45 C/W |
| Thermal Resistance Junction-to-Case (RθJC) End-of-Life | — | 0.65 C/W (after 1000 cycles -55C to +150C) |
| Suhu Hubungan Operasi | — | -55C to +175C |