K3LK4K40CM-BGCP vs K3LK8K80CM-MFCP Perbandingan
Perbandingan bersamaan detil K3LK4K40CM-BGCP dari Samsung Electronics dan K3LK8K80CM-MFCP dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K3LK4K40CM-BGCP | K3LK8K80CM-MFCP |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Density | 96 Gb (12 GB) | 48 Gbit (6 GB) |
| Organisasi | 1536M x 64 | [DATA_NEEDED: organization (x width)] |
| Laju Data | 6400 Mbps per pin | — |
| Supply Voltage (VDD) | 1.05 V | — |
| Paket | 496-ball FBGA | 315-ball FBGA (MFCP) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Antarmuka | LPDDR5 (JEDEC) | LPDDR5 (JESD209-5 class low-power DRAM interface) |
| Suhu Kerja | [DATA_NEEDED: Operating Temperature] | -40 C to +105 C (automotive-grade) |
| Access Time / CAS Latency | [DATA_NEEDED: CAS Latency] | — |
| Refresh Scheme | Per-bank / all-bank refresh | — |
| Power-Down Modes | Deep sleep / power-down supported | — |
| Application Segment | Mobile, embedded, computing modules | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | unknown |
| Packaging | [DATA_NEEDED: standard packing quantity] | — |
| Pin Speed | — | 6400 Mbps |
| Data Rate (package) | — | 51.2 GB/s (family max) |
| Ball Count | — | 315 |
| Tegangan Pemuat | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| Power Saving vs LPDDR4X | — | Approximately 20% |
| Generation | — | LPDDR5 (5th generation low-power DRAM) |
| Application Grade | — | Automotive-grade storage chip |
| Place of Origin | — | Johor, Malaysia |