K3LK8K80CM-MFCP vs K3LK4K40CM-BGCP Perbandingan
Perbandingan bersamaan detil K3LK8K80CM-MFCP dari Samsung Electronics dan K3LK4K40CM-BGCP dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K3LK8K80CM-MFCP | K3LK4K40CM-BGCP |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Density | 48 Gbit (6 GB) | 96 Gb (12 GB) |
| Organisasi | [DATA_NEEDED: organization (x width)] | 1536M x 64 |
| Pin Speed | 6400 Mbps | — |
| Data Rate (package) | 51.2 GB/s (family max) | — |
| Antarmuka | LPDDR5 (JESD209-5 class low-power DRAM interface) | LPDDR5 (JEDEC) |
| Paket | 315-ball FBGA (MFCP) | 496-ball FBGA |
| Ball Count | 315 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40 C to +105 C (automotive-grade) | [DATA_NEEDED: Operating Temperature] |
| Tegangan Pemuat | [DATA_NEEDED: VDD/VDDQ voltage] | — |
| Power Saving vs LPDDR4X | Approximately 20% | — |
| Generation | LPDDR5 (5th generation low-power DRAM) | — |
| Application Grade | Automotive-grade storage chip | — |
| Place of Origin | Johor, Malaysia | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS Status] |
| Laju Data | — | 6400 Mbps per pin |
| Supply Voltage (VDD) | — | 1.05 V |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Refresh Scheme | — | Per-bank / all-bank refresh |
| Power-Down Modes | — | Deep sleep / power-down supported |
| Application Segment | — | Mobile, embedded, computing modules |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |