MC9S08DN60ACLH vs MC9S08DV128CLH Perbandingan
Perbandingan bersamaan detil MC9S08DN60ACLH dari NXP Semiconductors dan MC9S08DV128CLH dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S08DN60ACLH | MC9S08DV128CLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (S08 core) | — |
| Lebar Bus Data | 8 bit | 8-bit |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 6 KB (6K x 8) |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | — |
| Paket / Case | 64-LQFP (10x10 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | External |
| Interrupt Sources | Up to 32 | Up to 32 |
| Suhu Kerja | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | Tray |
| Status RoHS | Compliant | Compliant |
| Instruction Set | HC08 + BGND instruction | HC08 with BGND addition |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| Number of I/O Pins | — | 53 |
| Paket | — | 64-LQFP (10x10 mm) |
| Tegangan Pemuat Kerja | — | [DATA_NEEDED: Vdd range] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: temperature grade] |
| Integrated CAN Module | — | Yes (CAN 2.0) |