MC9S08DN60ACLH vs MC9S08DV128CLH Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DN60ACLH disebabkan oleh NXP Semiconductors dan MC9S08DV128CLH disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S08DN60ACLH | MC9S08DV128CLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (S08 core) | — |
| Lebar Bus Data | 8 bit | 8-bit |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 6 KB (6K x 8) |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | — |
| Kemasan / Case | 64-LQFP (10x10 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | External |
| Interrupt Sources | Up to 32 | Up to 32 |
| Suhu Operasi | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | Tray |
| Status RoHS | Compliant | Compliant |
| Instruction Set | HC08 + BGND instruction | HC08 with BGND addition |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| Number of I/O Pins | — | 53 |
| Kemasan | — | 64-LQFP (10x10 mm) |
| Tegangan Pemberi Arus Operasi | — | [DATA_NEEDED: Vdd range] |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: temperature grade] |
| Integrated CAN Module | — | Yes (CAN 2.0) |