MC9S08DN60ACLH vs MC9S08DV128CLH 比較
詳細並排比較 MC9S08DN60ACLH 由 NXP Semiconductors 與 MC9S08DV128CLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ 啟用中規格比較
| 參數 | MC9S08DN60ACLH | MC9S08DV128CLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core | HCS08 (S08 core) | — |
| 資料匯流排寬度 | 8 bit | 8-bit |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 6 KB (6K x 8) |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | — |
| 封裝 / 外殼 | 64-LQFP (10x10 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | External |
| Interrupt Sources | Up to 32 | Up to 32 |
| 工作溫度 | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | Tray |
| RoHS 狀態 | Compliant | Compliant |
| Instruction Set | HC08 + BGND instruction | HC08 with BGND addition |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| Number of I/O Pins | — | 53 |
| 封裝 | — | 64-LQFP (10x10 mm) |
| 工作電源電壓 | — | [DATA_NEEDED: Vdd range] |
| 工作溫度範圍 | — | [DATA_NEEDED: temperature grade] |
| Integrated CAN Module | — | Yes (CAN 2.0) |