MC9S12XDP512MAG vs MC9S12XDT512MAL Perbandingan

Perbandingan bersamaan detil MC9S12XDP512MAG dari NXP Semiconductors dan MC9S12XDT512MAL dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12XDP512MAG MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S12XDP512MAG MC9S12XDT512MAL
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit 16-bit
Frekuensi Bawah Maximum 80 MHz —
Flash Memory Size 512 KB (512K x 8) —
Tegangan Pemuat 2.5 V / 5 V 2.5 V / 5 V
Paket 144-LQFP (20x20 mm) —
Tipe Mounting Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Shape Square (LFQFP) —
ADC Resolution 10-bit —
Temperature Grade Automotive —
Qualification AEC-Q100 —
Instruction Set Compatibility Upward compatible with HCS12 —
External Bus Interface Yes (144-pin LQFP option) —
Target Application Domain Automotive multiplexing —
Status Lingkungan Hidup NRND (Not Recommended for New Designs) —
Core Architecture — CISC
Maximum CPU Speed — 80 MHz
Program Memory — 512 KB Flash
RAM — 20 KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — [DATA_NEEDED: number of I/O pins]
ADC — 8/10-bit (channels [DATA_NEEDED])
Package Type — 112-LQFP (20x20 mm)
Suhu Kerja — -40C to +125C
Series — MC9S12 / S12XD
Process Technology — TSMC3 (automotive qualified)
Boundary-Scan Debug — BDM + JTAG/Nexus
Status RoHS — [DATA_NEEDED: rohs status]
Lifecycle — NRND (Not Recommended for New Designs)

Spek dan Sumber

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