MC9S12XDP512MAG vs MC9S12XDT512MAL Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XDP512MAG disebabkan oleh NXP Semiconductors dan MC9S12XDT512MAL disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12XDP512MAG MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG Nrnd

Pengandingan Spesifikasi

Parametr MC9S12XDP512MAG MC9S12XDT512MAL
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit 16-bit
Frekuensi Klock Maksimum 80 MHz —
Flash Memory Size 512 KB (512K x 8) —
Tegangan Pemberi Arus 2.5 V / 5 V 2.5 V / 5 V
Kemasan 144-LQFP (20x20 mm) —
Jenis Pemasangan Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Shape Square (LFQFP) —
ADC Resolution 10-bit —
Temperature Grade Automotive —
Qualification AEC-Q100 —
Instruction Set Compatibility Upward compatible with HCS12 —
External Bus Interface Yes (144-pin LQFP option) —
Target Application Domain Automotive multiplexing —
Status Lingkungan Hidup NRND (Not Recommended for New Designs) —
Core Architecture — CISC
Maximum CPU Speed — 80 MHz
Program Memory — 512 KB Flash
RAM — 20 KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — [DATA_NEEDED: number of I/O pins]
ADC — 8/10-bit (channels [DATA_NEEDED])
Package Type — 112-LQFP (20x20 mm)
Suhu Operasi — -40C to +125C
Series — MC9S12 / S12XD
Process Technology — TSMC3 (automotive qualified)
Boundary-Scan Debug — BDM + JTAG/Nexus
Status RoHS — [DATA_NEEDED: rohs status]
Lifecycle — NRND (Not Recommended for New Designs)

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