MPC8555EPXAQF vs MPC8555EVTAQF Perbandingan

Perbandingan bersamaan detil MPC8555EPXAQF dari NXP Semiconductors dan MPC8555EVTAQF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC8555EVTAQF MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF Obsolete

Perbandingan Spesifikasi

Parameter Umum MPC8555EPXAQF MPC8555EVTAQF
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Obsolete
Architecture PowerPC e500 (Power Architecture technology) —
Core Count 1 1
Lebar Bus Data 32-Bit 32-bit
Core Frequency (Max) 1.0 GHz —
Supply Voltage (Core) 1.2 V 1.2 V
Package Type FCPBGA (Flip Chip Plastic BGA) FC-PBGA, flip-chip plastic BGA
Pin / Ball Count 783 —
Package Dimensions 29 x 29 mm, 1 mm pitch, 3.75 mm height —
Tipe Mounting Surface Mount Surface Mount
Suhu Kerja [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Series PowerQUICC III (MPC85xx) PowerQUICC III, MPC85xx
Part Marketing Code PQ 37 LITE 8555E —
Integrated Peripherals [DATA_NEEDED: integrated peripherals list] —
Memory Controller [DATA_NEEDED: DDR1/DDR2 support details] —
Ethernet MACs [DATA_NEEDED: number of GbE MACs] —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Level MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Manufacturer — NXP USA Inc.
Core Architecture — PowerPC e500
Core Frequency — 1.0 GHz
Paket — 783-FCPBGA (29x29 mm)
Jumlah Pin — 783
Ball Pitch — 1.0 mm
L1 Cache — 32 KB instruction / 32 KB data

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