MPC8555EPXAQF vs MPC8555EVTAQF 比較

詳細並排比較 MPC8555EPXAQF 由 NXP Semiconductors 與 MPC8555EVTAQF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8555EVTAQF MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF Obsolete

規格比較

參數 MPC8555EPXAQF MPC8555EVTAQF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND Obsolete
Architecture PowerPC e500 (Power Architecture technology) —
Core Count 1 1
資料匯流排寬度 32-Bit 32-bit
Core Frequency (Max) 1.0 GHz —
Supply Voltage (Core) 1.2 V 1.2 V
Package Type FCPBGA (Flip Chip Plastic BGA) FC-PBGA, flip-chip plastic BGA
Pin / Ball Count 783 —
Package Dimensions 29 x 29 mm, 1 mm pitch, 3.75 mm height —
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Series PowerQUICC III (MPC85xx) PowerQUICC III, MPC85xx
Part Marketing Code PQ 37 LITE 8555E —
Integrated Peripherals [DATA_NEEDED: integrated peripherals list] —
Memory Controller [DATA_NEEDED: DDR1/DDR2 support details] —
Ethernet MACs [DATA_NEEDED: number of GbE MACs] —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
MSL 等級 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Manufacturer — NXP USA Inc.
Core Architecture — PowerPC e500
Core Frequency — 1.0 GHz
封裝 — 783-FCPBGA (29x29 mm)
腳位數 — 783
Ball Pitch — 1.0 mm
L1 Cache — 32 KB instruction / 32 KB data

資料表與資源

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