MPC860TVR50D4 vs MPC860TCZQ50D4 Perbandingan

Perbandingan bersamaan detil MPC860TVR50D4 dari NXP Semiconductors dan MPC860TCZQ50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC860TVR50D4 MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 Obsolete
NXP Semiconductors
MPC860TCZQ50D4 MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MPC860TVR50D4 MPC860TCZQ50D4
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete Akhir Hidup
Core Architecture PowerPC 32-bit PowerPC
Core Count 1 —
Frekuensi Bawah Maximum 50 MHz —
Operating Supply Voltage (Core) 3.3 V —
Operating Supply Voltage (I/O) 3.3 V —
Paket / Case 357-PBGA (25x25 mm) —
Process Technology 0.32 µm CMOS 0.32 um CMOS (per FindIC description)
Instruction Cache 4 Kbyte —
Data Cache 4 Kbyte —
Integrated Communications Module (CPM) Yes (SCC, SMC, SPI, I²C, UART) —
PCMCIA Interface Yes (Type I/II) —
Memory Controller DRAM, SRAM, EPROM, Flash Up to 256 MB DRAM with page mode support
Rentang Suhu Kerja -40°C to +95°C —
Tipe Mounting Surface Mount (BGA) Surface Mount
Series MPC8xx PowerQUICC —
Status RoHS [DATA_NEEDED: rohs compliance] Non-Compliant (per NXP product page / DigiChip datasheet)
Lead-Free / Reflow Profile [DATA_NEEDED: reflow profile] —
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Number — MPC860TCZQ50D4
Family — PowerQUICC / MPC8xx
Core — MPC8xx - 1 core, 32-bit
Core Clock Speed — 50 MHz
Instruction / Data Cache — 4 KB / 4 KB (unified 8KB figure variant-dependent)
Tegangan Pemuat Kerja — 2 V to 3.6 V (per FindIC comparison page)
Paket — 357-PBGA (25x25 mm), ZQ suffix
Suhu Kerja — -40C to +95C (industrial)
Lead-Free — Contains lead (ZQ denotes tin-lead ball finish)
CPM (Communications Processor Module) — Integrated - HDLC, UART, Ethernet 10 Mbps support
DMA Channels — 4
Status Lingkungan Hidup — End of Life (NXP Last Time Buy window passed)

Spek dan Sumber

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