MPC860TVR50D4 vs MPC860TCZQ50D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860TVR50D4 sa pamamagitan ng NXP Semiconductors at MPC860TCZQ50D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC860TVR50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Tapus ng Buhay |
| Core Architecture | PowerPC 32-bit | PowerPC |
| Core Count | 1 | — |
| Maksimum na Taktiko ng Oras | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Packhaging / Kaso | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 um CMOS (per FindIC description) |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | Up to 256 MB DRAM with page mode support |
| Hanay ng Temperature na Operasyon | -40°C to +95°C | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | — |
| Tindminan RoHS | [DATA_NEEDED: rohs compliance] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Supply Voltage na Operasyon | — | 2 V to 3.6 V (per FindIC comparison page) |
| Packhaging | — | 357-PBGA (25x25 mm), ZQ suffix |
| Temperature na Operasyon | — | -40C to +95C (industrial) |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Katayuan ng Lifecycle | — | End of Life (NXP Last Time Buy window passed) |