MPC860TVR50D4 vs MPC860TCZQ50D4 Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPC860TVR50D4 tarafından NXP Semiconductors ve MPC860TCZQ50D4 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPC860TVR50D4 MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 Obsolete
NXP Semiconductors
MPC860TCZQ50D4 MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 ✗ Son Kullanım Zamanı

Özellik Karşılaştırması

Parametre MPC860TVR50D4 MPC860TCZQ50D4
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Obsolete Hayat Dönemi Sonu
Core Architecture PowerPC 32-bit PowerPC
Core Count 1 —
Azami Saat Hızı 50 MHz —
Operating Supply Voltage (Core) 3.3 V —
Operating Supply Voltage (I/O) 3.3 V —
Paket / Kas 357-PBGA (25x25 mm) —
Process Technology 0.32 µm CMOS 0.32 um CMOS (per FindIC description)
Instruction Cache 4 Kbyte —
Data Cache 4 Kbyte —
Integrated Communications Module (CPM) Yes (SCC, SMC, SPI, I²C, UART) —
PCMCIA Interface Yes (Type I/II) —
Memory Controller DRAM, SRAM, EPROM, Flash Up to 256 MB DRAM with page mode support
İşletim Sıcaklığı Aralığı -40°C to +95°C —
Montaj Türü Surface Mount (BGA) Surface Mount
Series MPC8xx PowerQUICC —
RoHS Durumu [DATA_NEEDED: rohs compliance] Non-Compliant (per NXP product page / DigiChip datasheet)
Lead-Free / Reflow Profile [DATA_NEEDED: reflow profile] —
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Number — MPC860TCZQ50D4
Family — PowerQUICC / MPC8xx
Core — MPC8xx - 1 core, 32-bit
Core Clock Speed — 50 MHz
Instruction / Data Cache — 4 KB / 4 KB (unified 8KB figure variant-dependent)
İşletim Besleme Gerilimi — 2 V to 3.6 V (per FindIC comparison page)
Paket — 357-PBGA (25x25 mm), ZQ suffix
İşletim Sıcaklığı — -40C to +95C (industrial)
Lead-Free — Contains lead (ZQ denotes tin-lead ball finish)
CPM (Communications Processor Module) — Integrated - HDLC, UART, Ethernet 10 Mbps support
DMA Channels — 4
Yaşam Döngüsü Durumu — End of Life (NXP Last Time Buy window passed)

Dökümanlar & Kaynaklar

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