MPC860TZQ66D4 vs MPC860PZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860TZQ66D4 dari NXP Semiconductors dan MPC860PZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860TZQ66D4 | MPC860PZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Manufacturer | NXP Semiconductors | — |
| Part Family | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC, 32-bit | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Core Frequency | 66 MHz | — |
| Tegangan Pemuat | 3.3 V | — |
| Paket / Case | 357-PBGA (25x25 mm) | — |
| Packaging | Tray | Tray |
| Suhu Kerja | 0 °C to +70 °C | -40C to +95C (industrial, per D4 revision) |
| Lead Free Status | Contains Lead | — |
| Status RoHS | RoHS non-compliant (Contains Lead) | Non-Compliant (Contains Lead) |
| Communications Module | CPM (QUICC Engine) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status Lingkungan Hidup | End of Life (per NXP) | — |
| Kategori | Microprocessors - MPU | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Paket | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead (non-RoHS) |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| Level MSL | — | 3 |
| Series | — | PowerQUICC |