MPC860TZQ66D4 vs MPC860PZQ66D4 比較
詳細並排比較 MPC860TZQ66D4 由 NXP Semiconductors 與 MPC860PZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860TZQ66D4 | MPC860PZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Manufacturer | NXP Semiconductors | — |
| Part Family | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC, 32-bit | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Core Frequency | 66 MHz | — |
| 供應電壓 | 3.3 V | — |
| 封裝 / 外殼 | 357-PBGA (25x25 mm) | — |
| Packaging | Tray | Tray |
| 工作溫度 | 0 °C to +70 °C | -40C to +95C (industrial, per D4 revision) |
| Lead Free Status | Contains Lead | — |
| RoHS 狀態 | RoHS non-compliant (Contains Lead) | Non-Compliant (Contains Lead) |
| Communications Module | CPM (QUICC Engine) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 生命週期狀態 | End of Life (per NXP) | — |
| 類別 | Microprocessors - MPU | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| 工作電源電壓 | — | 3.3 V |
| 封裝 | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead (non-RoHS) |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| MSL 等級 | — | 3 |
| Series | — | PowerQUICC |