MPC860TZQ66D4 vs MPC860PZQ66D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860TZQ66D4 disebabkan oleh NXP Semiconductors dan MPC860PZQ66D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860TZQ66D4 | MPC860PZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Manufacturer | NXP Semiconductors | — |
| Part Family | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC, 32-bit | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Core Frequency | 66 MHz | — |
| Tegangan Pemberi Arus | 3.3 V | — |
| Kemasan / Case | 357-PBGA (25x25 mm) | — |
| Packaging | Tray | Tray |
| Suhu Operasi | 0 °C to +70 °C | -40C to +95C (industrial, per D4 revision) |
| Lead Free Status | Contains Lead | — |
| Status RoHS | RoHS non-compliant (Contains Lead) | Non-Compliant (Contains Lead) |
| Communications Module | CPM (QUICC Engine) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status Lingkungan Hidup | End of Life (per NXP) | — |
| Kategori | Microprocessors - MPU | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| Tegangan Pemberi Arus Operasi | — | 3.3 V |
| Kemasan | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead (non-RoHS) |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| Aras MSL | — | 3 |
| Series | — | PowerQUICC |