MPC875CVR133 vs MPC875VR133 Perbandingan
Perbandingan bersamaan detil MPC875CVR133 dari NXP Semiconductors dan MPC875VR133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC875CVR133 | MPC875VR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (Power Architecture Technology) | — |
| Lebar Bus Data | 32-bit | 32 bit |
| Frekuensi Bawah Maximum | 133 MHz | — |
| Performance | 176 MIPS | 176 MIPS |
| Number of Cores | 1 | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Suhu Kerja | -40C to +100C | 0 °C to +95 °C |
| Paket | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Count | — | 1 |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |