MPC875CVR133 vs MPC875VR133 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC875CVR133 disebabkan oleh NXP Semiconductors dan MPC875VR133 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC875VR133 MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 Obsolete

Pengandingan Spesifikasi

Parametr MPC875CVR133 MPC875VR133
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
Lebar Bus Data 32-bit 32 bit
Frekuensi Klock Maksimum 133 MHz —
Performance 176 MIPS 176 MIPS
Number of Cores 1 —
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
Suhu Operasi -40C to +100C 0 °C to +95 °C
Kemasan 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
Status RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
Aras MSL [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Series — PowerQUICC, MPC8xx
Core Architecture — Power Architecture (32-bit RISC)
Core Count — 1
Core Frequency — 133 MHz
Process Technology — 0.18 µm CMOS
Supply Voltage (I/O) — 3.3 V
Package Type — 256-PBGA (HBGA), 23x23 mm
Terminal Pitch — 1.27 mm
On-chip Communications — CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII
Memory Controller — SDRAM, Flash, SRAM, ROM support
PCI Bridge — Integrated (PCI 2.1)

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