MPC875CVR133 vs MPC875VR133 比較

詳細並排比較 MPC875CVR133 由 NXP Semiconductors 與 MPC875VR133 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC875VR133 MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 Obsolete

規格比較

參數 MPC875CVR133 MPC875VR133
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
資料匯流排寬度 32-bit 32 bit
最大時脈頻率 133 MHz —
Performance 176 MIPS 176 MIPS
Number of Cores 1 —
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
工作溫度 -40C to +100C 0 °C to +95 °C
封裝 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
安裝類型 Surface Mount Surface Mount (BGA)
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
RoHS 狀態 [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Series — PowerQUICC, MPC8xx
Core Architecture — Power Architecture (32-bit RISC)
Core Count — 1
Core Frequency — 133 MHz
Process Technology — 0.18 µm CMOS
Supply Voltage (I/O) — 3.3 V
Package Type — 256-PBGA (HBGA), 23x23 mm
Terminal Pitch — 1.27 mm
On-chip Communications — CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII
Memory Controller — SDRAM, Flash, SRAM, ROM support
PCI Bridge — Integrated (PCI 2.1)

資料表與資源

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