S9S08DZ60F1CLH vs MC9S08DN60ACLH Perbandingan
Perbandingan bersamaan detil S9S08DZ60F1CLH dari NXP Semiconductors dan MC9S08DN60ACLH dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP
S9S08DZ60F1CLH ObsoletePerbandingan Spesifikasi
| Parameter Umum | S9S08DZ60F1CLH | MC9S08DN60ACLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Core Processor | S08 | — |
| Core Size | 8-bit | — |
| Frekuensi Bawah Maximum | 40 MHz | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| EEPROM Size | 2 KB (2K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 2 KB (2K x 8) |
| Supply Voltage (Vdd) | 2.7 V to 5.5 V | — |
| Number of I/O Pins | 53 | — |
| Paket | 64-LQFP (10x10 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Connectivity | CAN, I2C, LIN, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] | 16-channel, 12-bit, 2.5 us conversion |
| Suhu Kerja | -40 C to +85 C (industrial) / -40 C to +125 C (automotive) | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Mask Set | M74K | — |
| Status Lingkungan Hidup | Obsolete (mask-only factory stock) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] | — |
| Core | — | HCS08 (S08 core) |
| Lebar Bus Data | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Paket / Case | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| Status RoHS | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |