S9S08DZ60F1CLH vs MC9S08DN60ACLH Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S9S08DZ60F1CLH sa pamamagitan ng NXP Semiconductors at MC9S08DN60ACLH sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP
S9S08DZ60F1CLH ObsoletePagsanggunian na paghahambing
| Parametro | S9S08DZ60F1CLH | MC9S08DN60ACLH |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Core Processor | S08 | — |
| Core Size | 8-bit | — |
| Maksimum na Taktiko ng Oras | 40 MHz | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| EEPROM Size | 2 KB (2K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 2 KB (2K x 8) |
| Supply Voltage (Vdd) | 2.7 V to 5.5 V | — |
| Number of I/O Pins | 53 | — |
| Packhaging | 64-LQFP (10x10 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Connectivity | CAN, I2C, LIN, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] | 16-channel, 12-bit, 2.5 us conversion |
| Temperature na Operasyon | -40 C to +85 C (industrial) / -40 C to +125 C (automotive) | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Mask Set | M74K | — |
| Katayuan ng Lifecycle | Obsolete (mask-only factory stock) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] | — |
| Core | — | HCS08 (S08 core) |
| Width ng Data Bus | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Packhaging / Kaso | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| Tindminan RoHS | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |