S9S08DZ60F1CLH vs MC9S08DN60ACLH Karşılaştırma
Ayrıntılı yan yana karşılaştırma S9S08DZ60F1CLH tarafından NXP Semiconductors ve MC9S08DN60ACLH tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP
S9S08DZ60F1CLH ObsoleteÖzellik Karşılaştırması
| Parametre | S9S08DZ60F1CLH | MC9S08DN60ACLH |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Obsolete | NRND |
| Core Processor | S08 | — |
| Core Size | 8-bit | — |
| Azami Saat Hızı | 40 MHz | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| EEPROM Size | 2 KB (2K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 2 KB (2K x 8) |
| Supply Voltage (Vdd) | 2.7 V to 5.5 V | — |
| Number of I/O Pins | 53 | — |
| Paket | 64-LQFP (10x10 mm) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| Connectivity | CAN, I2C, LIN, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] | 16-channel, 12-bit, 2.5 us conversion |
| İşletim Sıcaklığı | -40 C to +85 C (industrial) / -40 C to +125 C (automotive) | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Mask Set | M74K | — |
| Yaşam Döngüsü Durumu | Obsolete (mask-only factory stock) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] | — |
| Core | — | HCS08 (S08 core) |
| Veri Bus Genişliği | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Paket / Kas | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| RoHS Durumu | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |