S9S08DZ60F1CLH vs MC9S08DN60ACLH Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08DZ60F1CLH disebabkan oleh NXP Semiconductors dan MC9S08DN60ACLH disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP
S9S08DZ60F1CLH ObsoletePengandingan Spesifikasi
| Parametr | S9S08DZ60F1CLH | MC9S08DN60ACLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Core Processor | S08 | — |
| Core Size | 8-bit | — |
| Frekuensi Klock Maksimum | 40 MHz | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| EEPROM Size | 2 KB (2K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 2 KB (2K x 8) |
| Supply Voltage (Vdd) | 2.7 V to 5.5 V | — |
| Number of I/O Pins | 53 | — |
| Kemasan | 64-LQFP (10x10 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Connectivity | CAN, I2C, LIN, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] | 16-channel, 12-bit, 2.5 us conversion |
| Suhu Operasi | -40 C to +85 C (industrial) / -40 C to +125 C (automotive) | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Mask Set | M74K | — |
| Status Lingkungan Hidup | Obsolete (mask-only factory stock) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] | — |
| Core | — | HCS08 (S08 core) |
| Lebar Bus Data | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Kemasan / Case | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| Status RoHS | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |