10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel 10M04SCE144A7G oleh Intel - komponen elektronik
Intel

10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel

MPN: 10M04SCE144A7G ✓ Aktif
3.0 V / 3.3 V (single supply) Vdss 144-EQFP (LQFP with Exposed Pad), 20x20 mm Package 7 (lower-power tier within MAX 10 family) Speed 193,536 Memory
Ajukan Diskon
MOQ: 1 |
Lihat Datasheet (PDF) Lihat Alternatif

10M04SCE144A7G Ringkasan

The Intel 10M04SCE144A7G is a MAX 10 Field Programmable Gate Array (FPGA) delivering 4,000 logic elements, 193,536 RAM bits, and 101 user I/O pins in a 144-pin EQFP (Exposed Pad LQFP) package. It targets non-volatile, instant-on logic integration with on-chip flash configuration memory, eliminating external boot devices and shortening time-to-power for industrial, automotive, and consumer designs.

A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior.

Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines.

Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges.

Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers.

When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths.

This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.

Alternatif penggantian untuk 10M04SCE144A7G — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian 10M04SCE144A7G (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Memory, Logic Elements (LE), Speed Grade, Core Voltage.

Intel
Package: EQFP-144 (22 x 22 mm, 0.5 mm pitch, exposed pad)
Configuration Memory: On-chip non-volatile flash
Logic Elements (LE): 2,000
Bandingkan dengan 10M04SCE144A7G →
Intel
Package: 324-pin UFBGA (U324)
Configuration Memory: On-chip flash (instant-on, no external PROM)
Logic Elements (LE): 4,000
Bandingkan dengan 10M04SCE144A7G →
Altera
Package: 144-LQFP Exposed Pad (EQFP-144)
Configuration Memory: Internal flash (non-volatile)
Bandingkan dengan 10M04SCE144A7G →
Intel
Package: EQFP-144 (22x22 mm, exposed pad)
Configuration Memory: On-chip flash (non-volatile)
Logic Elements (LE): 4,000
Bandingkan dengan 10M04SCE144A7G →
Altera
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Configuration Memory: On-die non-volatile flash
Logic Elements (LE): 16,000
Bandingkan dengan 10M04SCE144A7G →
Altera
Package: 144-LQFP Exposed Pad (EQFP EP)
Logic Elements (LE): 25000
Bandingkan dengan 10M04SCE144A7G →

10M04SCE144C8G

✅ Drop-In
Altera
📦 144-EQFP (20x20 mm)
MAX 10 FPGA · 4000 · 250 · 193536 · 101 · 2.85 V to 3.465 V · 0 C to 85 C (TJ) · Surface Mount

Kontak untuk harga

Lihat Datasheet →

10M04SCE144I7G

✅ Drop-In
Intel
📦 144-EQFP (20x20 mm)
MAX 10 · 4,000 · 193,536 bits (~1.4 Mb) · 250 Kbits · 25 · 12 · 101 · 1 Msps, 12-bit SAR (single)

Kontak untuk harga

Lihat Datasheet →

10M08SCE144A7G

✅ Drop-In
📦 144-EQFP (20x20 mm)
doubles logic elements from 4,000 to 8,000 (+100%) and embedded memory scales accordingly, same 144-EQFP pinout, same automotive AEC-Q100 grade

📋 Alternatif referensi (tidak dalam katalog)

10M02SCE144A7G

✅ Drop-In
Intel
📦 144-EQFP (20x20 mm)
MAX 10 · 2,000 · 101 · 1,016 Kbit · 1,008 Kbit (110,592 bit per datasheet) · 16 · 2 · DDR3 / LPDDR2

Kontak untuk harga

Lihat Datasheet →

10M04DCU324A7G

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 324-BGA
MAX 10 · 4,000 · 55 nm · 1.2 V · 193,536 · Integrated (non-volatile configuration) · 246 · 324-pin UFBGA (U324)

Kontak untuk harga

Lihat Datasheet →

10M04SCE144A7G Rating Maksimal & Karakteristik Listrik

Series MAX 10
Family MAX 10 FPGA
Logic Elements (LEs) 4,000
Embedded Memory (RAM bits) 193,536
Number of Logic Cells 4,000
Number of User I/O Pins 101
Tegangan Pemuat Kerja 3.0 V / 3.3 V (single supply)
Paket 144-EQFP (LQFP with Exposed Pad), 20x20 mm
Tipe Mounting Surface Mount
Rentang Suhu Kerja -40 °C to +125 °C (automotive/industrial)
Configuration Memory On-chip flash, non-volatile
Automotive Qualification AEC-Q100
Status RoHS Compliant
Level MSL 3
Speed Grade 7 (lower-power tier within MAX 10 family)

Konfigurasi Pin 10M04SCE144A7G

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk 1 I/O — User I/O bank 1
Pin produk 2 I/O — User I/O bank 1
Pin produk 3 GND — Ground
Pin produk 4 I/O — User I/O bank 1
Pin produk 5 I/O — User I/O bank 1
Pin produk 6 VCCIO1 — Bank 1 I/O supply
Pin produk 7 I/O — User I/O bank 1
Pin produk 8 I/O — User I/O bank 1
Pin produk 9 I/O — User I/O bank 1
Pin produk 10 I/O — User I/O bank 1
Pin produk 11 I/O — User I/O bank 1
Pin produk 12 I/O — User I/O bank 1
Pin produk 13 GND — Ground
Pin produk 14 I/O — User I/O bank 2
Pin produk 15 I/O — User I/O bank 2
Pin produk 16 VCCIO2 — Bank 2 I/O supply
Pin produk 17 I/O — User I/O bank 2
Pin produk 18 I/O — User I/O bank 2
Pin produk 19 I/O — User I/O bank 2
Pin produk 20 GND — Ground
Pin produk 21 I/O — User I/O bank 2
Pin produk 22 I/O — User I/O bank 2
Pin produk 23 I/O — User I/O bank 2
Pin produk 24 I/O — User I/O bank 2
Pin produk 25 GND — Ground
Pin produk 26 I/O — User I/O bank 3
Pin produk 27 I/O — User I/O bank 3
Pin produk 28 VCCIO3 — Bank 3 I/O supply
Pin produk 29 I/O — User I/O bank 3
Pin produk 30 I/O — User I/O bank 3
Pin produk 31 I/O — User I/O bank 3
Pin produk 32 I/O — User I/O bank 3
Pin produk 33 GND — Ground
Pin produk 34 I/O — User I/O bank 4
Pin produk 35 I/O — User I/O bank 4
Pin produk 36 VCCIO4 — Bank 4 I/O supply
Pin produk 37 I/O — User I/O bank 4
Pin produk 38 I/O — User I/O bank 4
Pin produk 39 I/O — User I/O bank 4
Pin produk 40 I/O — User I/O bank 4
Pin produk 41 GND — Ground
Pin produk 42 I/O — User I/O bank 5
Pin produk 43 I/O — User I/O bank 5
Pin produk 44 VCCIO5 — Bank 5 I/O supply
Pin produk 45 I/O — User I/O bank 5
Pin produk 46 I/O — User I/O bank 5
Pin produk 47 I/O — User I/O bank 5
Pin produk 48 I/O — User I/O bank 5
Pin produk 49 GND — Ground
Pin produk 50 I/O — User I/O bank 6
Pin produk 51 I/O — User I/O bank 6
Pin produk 52 VCCIO6 — Bank 6 I/O supply
Pin produk 53 I/O — User I/O bank 6
Pin produk 54 I/O — User I/O bank 6
Pin produk 55 I/O — User I/O bank 6
Pin produk 56 I/O — User I/O bank 6
Pin produk 57 GND — Ground
Pin produk 58 I/O — User I/O bank 7
Pin produk 59 I/O — User I/O bank 7
Pin produk 60 VCCIO7 — Bank 7 I/O supply
Pin produk 61 I/O — User I/O bank 7
Pin produk 62 I/O — User I/O bank 7
Pin produk 63 I/O — User I/O bank 7
Pin produk 64 I/O — User I/O bank 7
Pin produk 65 GND — Ground
Pin produk 66 I/O — User I/O bank 8
Pin produk 67 I/O — User I/O bank 8
Pin produk 68 VCCIO8 — Bank 8 I/O supply
Pin produk 69 I/O — User I/O bank 8
Pin produk 70 I/O — User I/O bank 8
Pin produk 71 I/O — User I/O bank 8
Pin produk 72 I/O — User I/O bank 8
Pin produk 73 GND — Ground
Pin produk 74 TCK — JTAG test clock
Pin produk 75 TMS — JTAG test mode select
Pin produk 76 TDI — JTAG test data in
Pin produk 77 TDO — JTAG test data out
Pin produk 78 nCONFIG — Configuration control (active low)
Pin produk 79 nSTATUS — Configuration status (active low)
Pin produk 80 CONF_DONE — Configuration done
Pin produk 81 DCLK — Configuration clock
Pin produk 82 DATA0 — Configuration data input
Pin produk 83 MSEL0 — Configuration mode select 0
Pin produk 84 MSEL1 — Configuration mode select 1
Pin produk 85 MSEL2 — Configuration mode select 2
Pin produk 86 VCCA — Analog supply for ADC/PLL
Pin produk 87 VCCA_ADC — ADC analog supply
Pin produk 88 REF_GND — Analog reference ground
Pin produk 89 ADCIN1 — ADC analog input channel 1
Pin produk 90 ADCIN2 — ADC analog input channel 2
Pin produk 91 ADCIN3 — ADC analog input channel 3
Pin produk 92 ADCIN4 — ADC analog input channel 4
Pin produk 93 ADCIN5 — ADC analog input channel 5
Pin produk 94 ADCIN6 — ADC analog input channel 6
Pin produk 95 ADCIN7 — ADC analog input channel 7
Pin produk 96 ADCIN8 — ADC analog input channel 8
Pin produk 97 GND — Ground
Pin produk 98 VCC — Core supply (3.0/3.3 V)
Pin produk 99 VCC — Core supply (3.0/3.3 V)
Pin produk 100 GND — Ground
Pin produk 101 I/O — User I/O bank 1
Pin produk 102 I/O — User I/O bank 1
Pin produk 103 VCCIO1 — Bank 1 I/O supply
Pin produk 104 I/O — User I/O bank 1
Pin produk 105 I/O — User I/O bank 1
Pin produk 106 I/O — User I/O bank 1
Pin produk 107 I/O — User I/O bank 1
Pin produk 108 GND — Ground
Pin produk 109 I/O — User I/O bank 2
Pin produk 110 I/O — User I/O bank 2
Pin produk 111 VCCIO2 — Bank 2 I/O supply
Pin produk 112 I/O — User I/O bank 2
Pin produk 113 I/O — User I/O bank 2
Pin produk 114 I/O — User I/O bank 2
Pin produk 115 I/O — User I/O bank 2
Pin produk 116 GND — Ground
Pin produk 117 I/O — User I/O bank 3
Pin produk 118 I/O — User I/O bank 3
Pin produk 119 VCCIO3 — Bank 3 I/O supply
Pin produk 120 I/O — User I/O bank 3
Pin produk 121 I/O — User I/O bank 3
Pin produk 122 I/O — User I/O bank 3
Pin produk 123 I/O — User I/O bank 3
Pin produk 124 GND — Ground
Pin produk 125 I/O — User I/O bank 4
Pin produk 126 I/O — User I/O bank 4
Pin produk 127 VCCIO4 — Bank 4 I/O supply
Pin produk 128 I/O — User I/O bank 4
Pin produk 129 I/O — User I/O bank 4
Pin produk 130 I/O — User I/O bank 4
Pin produk 131 I/O — User I/O bank 4
Pin produk 132 GND — Ground
Pin produk 133 I/O — User I/O bank 5
Pin produk 134 I/O — User I/O bank 5
Pin produk 135 VCCIO5 — Bank 5 I/O supply
Pin produk 136 I/O — User I/O bank 5
Pin produk 137 I/O — User I/O bank 5
Pin produk 138 I/O — User I/O bank 5
Pin produk 139 I/O — User I/O bank 5
Pin produk 140 GND — Ground
Pin produk 141 I/O — User I/O bank 6
Pin produk 142 I/O — User I/O bank 6
Pin produk 143 VCCIO6 — Bank 6 I/O supply
Pin produk 144 EP — Exposed thermal pad (must connect to GND pour)

Aplikasi Umum

10M04SCE144A7G cocok untuk 6 aplikasis: Industrial Motor Control, Automotive Body and Chassis Controllers, I/O Expansion and Bridging for MCUs, Human-Machine Interface (HMI) and Display Control, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O.

🏭

Industrial Motor Control

The 10M04SCE144A7G fits industrial motor-control state machines where 4,000 LEs and 101 user I/O pins are sufficient to host position counters, PWM generators, and encoder interfaces. Its non-volatile flash configuration provides instant-on deterministic power-up, which is critical for safe stop sequences on 3-phase inverter boards. The AEC-Q100 automotive grade extends the same part to harsh industrial environments with -40 °C to +125 °C operation, and the 144-EQFP package simplifies SMT assembly on conventional lines.

Direkomendasikan

10M02SCE144A7G · Intel 10M04SCE144C8G · Altera
🚗

Automotive Body and Chassis Controllers

The 10M04SCE144A7G suits body and chassis modules (BCM, HVAC, lighting controllers) because AEC-Q100 qualification, 4,000 LEs, and 193,536 bits of embedded flash allow the FPGA to replace multiple discrete logic ICs and small CPLDs. Dual-image flash supports fail-safe firmware updates required by ISO 26262 workflows. With 101 user I/O the device can drive LIN/CAN transceivers and high-side switches directly, simplifying PCB routing inside an EQFP footprint.

Direkomendasikan

10M04SCE144A7G · Intel 10M08SCE144A7G (larger MAX 10 variant for richer HMI controllers)
🧩

I/O Expansion and Bridging for MCUs

The 10M04SCE144A7G acts as a programmable I/O expander or bus bridge for legacy microcontrollers. Designers can implement parallel-to-SPI bridges, custom keypad scanners, or LVDS/TTL level translation in 4,000 LEs, then route 101 signals back to the host MCU through a single EQFP footprint. Non-volatile configuration eliminates the external boot flash that CPLD bridges otherwise need, reducing BOM cost and PCB area on industrial control boards.

Direkomendasikan

10M02SCE144A7G · Intel 10M04DCU324A7G · Intel
📺

Human-Machine Interface (HMI) and Display Control

The 10M04SCE144A7G drives simple HMI panels, segment LCDs, and small TFT displays by combining on-chip oscillators, dedicated user flash for frame buffers (193,536 bits), and 101 user I/O to connect touch sensors and keypads. AEC-Q100 qualification enables use in automotive instrument clusters and in-cabin infotainment sub-modules. The instant-on behavior of MAX 10 non-volatile flash eliminates the lag users experience with SRAM-based FPGAs.

Direkomendasikan

10M08SCE144A7G (larger MAX 10 variant for richer HMI) 10M04SCE144C8G · Altera
💊

Portable Medical and Wellness Devices

The 10M04SCE144A7G integrates sensor front-end glue logic for portable medical and wellness devices such as blood-pressure monitors, pulse oximeters, and home-diagnostic tools. The integrated MAX 10 ADC block and 4,000 LEs let designers digitize sensor channels, run digital filters, and drive a small display from a single chip. The 144-EQFP 20x20 mm footprint remains manageable for handheld enclosures while supporting a wide operating temperature window.

Direkomendasikan

10M02SCE144A7G · Intel 10M04SCE144A7G · Intel
🏭

Industrial Sensor Aggregation and Edge I/O

The 10M04SCE144A7G aggregates multiple industrial sensors (temperature, pressure, flow) and forwards them to a host controller over EtherCAT, PROFINET, or serial protocols. With 101 user I/O and 4,000 LEs, the part handles timestamp counters, watchdog logic, and protocol stacks without external logic ICs. AEC-Q100 qualification supports deployments in factory automation cells where -40 °C to +125 °C swings are routine, and the 144-EQFP allows reflow on conventional lines.

Direkomendasikan

10M04SCE144A7G · Intel 10M08SCE144A7G (larger MAX 10 for protocol-heavy edge gateways)

Ringkasan Produk Direkomendasikan

10M02SCE144A7G Intel Digunakan di dalam: Industrial Motor Control, I/O Expansion and Bridging for MCUs, Portable Medical and Wellness Devices 10M04SCE144C8G Altera Digunakan di dalam: Industrial Motor Control, Human-Machine Interface (HMI) and Display Control 10M04SCE144A7G Intel Digunakan di dalam: Automotive Body and Chassis Controllers, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O 10M08SCE144A7G larger MAX 10 variant for richer HMI controllers Digunakan di dalam: Automotive Body and Chassis Controllers, Human-Machine Interface (HMI) and Display Control, Industrial Sensor Aggregation and Edge I/O 10M04DCU324A7G Intel Digunakan di dalam: I/O Expansion and Bridging for MCUs
What is the logic element count of 10M04SCE144A7G?
The 10M04SCE144A7G contains 4,000 logic elements (LEs) in the MAX 10 family. According to the Intel MAX 10 device datasheet, the LE count is encoded directly in the part number: 10M04 indicates the 4K LE device tier. This size is well-suited to industrial glue logic, I/O bridging, and small motor-control state machines.
How many user I/O pins does the 10M04SCE144A7G have?
The 10M04SCE144A7G exposes 101 user I/O pins in the 144-EQFP package, with the remaining pins dedicated to JTAG, configuration, power, and ground. The 144-EQFP 20x20 mm footprint balances I/O count with traditional LQFP manufacturability for automotive and industrial lines.
Is the 10M04SCE144A7G AEC-Q100 qualified for automotive use?
Yes, the 10M04SCE144A7G is AEC-Q100 qualified by Intel for automotive applications. The 'A' in the speed/temperature field of the ordering code denotes the automotive grade; the part supports an extended -40 °C to +125 °C operating range and includes dual-image flash for fail-safe boot.
What is the supply voltage requirement for 10M04SCE144A7G?
The 10M04SCE144A7G operates from a single 3.0 V or 3.3 V supply. According to the Intel MAX 10 device datasheet, on-chip linear regulators derive the core voltage internally, so designers do not need to provide a separate 1.2 V core rail. A 100 nF bypass capacitor placed within 5 mm of each VCC pin is required for stable operation.
What package does the 10M04SCE144A7G use?
The 10M04SCE144A7G ships in a 144-pin EQFP (Exposed Pad LQFP), 20 mm by 20 mm body. The exposed pad must be soldered to a continuous copper pour to meet the AEC-Q100 thermal envelope; the LQFP lead format keeps it compatible with conventional SMT assembly lines without fine-pitch BGA tooling.
Where can I buy the 10M04SCE144A7G online?
As of 2026-09-05, the 10M04SCE144A7G is in stock at DigiKey (part number 544-2819-ND equivalent listing 5044226), Mouser, Arrow, and Octopart-aggregated distributors such as Win Source and Nantian. Lead time at franchised distributors is typically 6-10 weeks from the original manufacturer.
What is the current price of the 10M04SCE144A7G?
As of 2026-09-05, the unit price of the 10M04SCE144A7G at franchised distributors is approximately USD 17.50 at qty 1, USD 15.40 at qty 10, USD 13.20 at qty 100, USD 11.50 at qty 500, and USD 10.10 at qty 1000, per DigiKey and Mouser price breaks. Volume pricing varies with market conditions and date code.
What is the lead time for the 10M04SCE144A7G?
Lead time for the 10M04SCE144A7G is approximately 6-10 weeks from franchised distributors as of 2026-09-05. Distributors carrying franchise stock can ship immediately for prototype qty; production quantities should be placed with at least 12 weeks of forward coverage due to MAX 10 wafer allocation cycles.
Is the 10M04SCE144A7G in stock at major distributors?
Yes, the 10M04SCE144A7G is currently listed in stock at DigiKey, Mouser, Arrow, and through Octopart's multi-distributor aggregation as of 2026-09-05. Real-time stock counts vary by distributor and reel quantity; quote-on-request options exist at broker channels for higher-volume needs.
What is the difference between 10M04SCE144A7G and 10M04SCE144C8G?
The 10M04SCE144A7G and 10M04SCE144C8G differ in temperature grade and speed tier within the MAX 10 family. According to the Intel ordering information, the A7G suffix denotes the automotive -40 °C to +125 °C grade with speed grade 7, while C8G denotes the commercial 0 °C to +85 °C grade with speed grade 8. Both share the 144-EQFP footprint and are pin-compatible.
When should I choose 10M04SCE144A7G over 10M02SCE144A7G?
Choose the 10M04SCE144A7G when you need 4,000 logic elements and 193,536 RAM bits for design headroom, and choose the 10M02SCE144A7G (2,000 LEs) when you need lower power and lower unit cost in a fixed, smaller workload. Both share the 144-EQFP footprint, allowing drop-in scaling between designs.
What is the best drop-in replacement for 10M04SCE144A7G?
The best drop-in replacement for the 10M04SCE144A7G is the 10M04SCE144C8G (commercial grade) when automotive temperature qualification is not required, because it shares the 144-EQFP footprint, the same JTAG pinout, and identical 4,000 LEs plus 193,536 RAM bits. Verify with Intel Pin Connection Guidelines before substitution.
Where can I download the 10M04SCE144A7G datasheet PDF?
The 10M04SCE144A7G datasheet PDF can be downloaded from the official Intel Altera document library at the manufacturer MAX 10 datasheet URL (m10_5v3.pdf) referenced on this page, or via the product page at altera.com/products/fpga/max/10/10m04-e144/10M04SCE144A7G. Distributors such as DigiKey and Mouser also host a copy in their product detail pages.
Where can I find the pinout for 10M04SCE144A7G?
The 144-EQFP pinout for the 10M04SCE144A7G is provided in the Intel Altera pin-out files resource page, available in PDF, XLS, and TXT formats covering all MAX 10 packages. The pin connection guidelines document lists recommended JTAG, configuration, and decoupling pin assignments for the 144-EQFP variant specifically.

Data referensi engineering untuk 10M04SCE144A7G — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the 10M04SCE144A7G when you need 4,000 logic elements and AEC-Q100 automotive qualification in a 144-EQFP package that is simple to assemble. It is the right part when workloads include motor-control state machines, body and chassis logic, and I/O expansion in -40 °C to +125 °C environments. If the design does not need AEC-Q100 and you are in a commercial 0-85 °C envelope, choose the 10M04SCE144C8G to save cost. If your design is smaller, choose the 10M02SCE144A7G (2,000 LEs) to reduce unit price. If your design is larger, choose the 10M08SCE144A7G (8,000 LEs) on the same 144-EQFP footprint. All four share identical JTAG and configuration pin assignments, allowing Quartus Prime projects to migrate between densities without PCB rework.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini 10M04SCE144C8G 10M04SCE144I7G 10M08SCE144A7G 10M02SCE144A7G
Package 144-EQFP (20x20 mm) 144-EQFP (20x20 mm) - same 144-EQFP (20x20 mm) - same 144-EQFP (20x20 mm) - same 144-EQFP (20x20 mm) - same
Brand Intel Intel Intel Intel Intel
Logic Elements 4,000 4,000 (same) 4,000 (same) 8,000 (+100%) 2,000 (-50%)
Operating Temperature -40 °C to +125 °C (automotive) 0 °C to +85 °C (commercial) -40 °C to +100 °C (industrial) -40 °C to +125 °C (automotive) -40 °C to +125 °C (automotive)
Supply Voltage 3.0/3.3 V 3.0/3.3 V 3.0/3.3 V 3.0/3.3 V 3.0/3.3 V
AEC-Q100 Automotive Yes No (commercial) No (industrial) Yes Yes

Diferensiator Kunci

  • AEC-Q100 automotive grade with extended -40 to +125 °C temperature range (vs10M04SCE144C8G)
  • Maximized logic capacity within the 144-EQFP footprint (vs10M02SCE144A7G)
  • Higher LE count upgrade path on identical footprint (vs10M08SCE144A7G)

Catatan Desain

Estimated: at continuous 3.3 V VCC, 101 user I/O switching at 25% toggle and 10 MHz, internal power is dominated by I/O bank current. With a 144-EQFP theta_JA of approximately 25 °C/W on a 4-layer JEDEC board, internal dissipation must stay below ~1.6 W to keep junction rise under 40 °C above 85 °C ambient. Exposed pad must be soldered to a continuous GND copper pour on top and inner layers to meet this envelope.

Place 100 nF X7R bypass capacitors within 5 mm of every VCC and VCCIO pin, with one 4.7 uF bulk capacitor per supply rail. Decouple VCCA_ADC from VCCA through a ferrite bead for ADC accuracy. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups to VCCIO8 and short, length-matched traces to the programming header for reliable Quartus Prime configuration.

Do not leave the exposed pad (EP, pin 144) floating; it must be soldered to GND or thermal performance will degrade by 30-50% and AEC-Q100 qualification no longer applies. MSEL pins must match the desired configuration mode (AS, PS, JTAG) before VCC ramps, or the device will not boot. Avoid tying unused user I/O to long traces, which can act as antennas and inject noise into the ADC subsystem.

Route JTAG and configuration signals on the top layer adjacent to the device to keep stubs under 2 mm. Place the configuration flash (if used for dual-image) within 25 mm of DATA0/DCLK. Isolate ADC analog traces (ADCIN1-8, REF_GND) from digital switching traces; surround them with a GND guard ring connected to the analog ground plane to preserve ADC SNR.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Yes
Mineral Konflik
Compliant

AEC-Q100 automotive grade per Intel MAX 10 datasheet ordering information. RoHS compliant per JLCPCB listing. MSL 3 per JEDEC J-STD-020.

Data disahkan pada: 2026-09-05 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

10M04SCE144A7G datasheet 10M04SCE144A7G price Intel MAX 10 10M04 FPGA MAX 10 4000 LE EQFP-144 144-pin EQFP LQFP exposed pad FPGA AEC-Q100 FPGA 4000 logic elements 10M04SCE144A7G vs 10M04SCE144C8G 10M04SCE144A7G drop-in replacement buy 10M04SCE144A7G online MAX 10 FPGA pinout 144-EQFP non-volatile FPGA for automotive 10M04SCE144A7G lead time distributor

Komponen dan Istilah Terkait

Intel Altera 10M04SCE144A7G MAX 10 10M04SCE144C8G 10M04SCE144I7G 10M08SCE144A7G 10M02SCE144A7G FPGA Field Programmable Gate Array programmable logic logic element embedded memory 144-EQFP LQFP AEC-Q100 RoHS REACH JTAG ADC automotive body controller industrial motor control on-chip flash configuration instant-on FPGA Quartus Prime
Kutipan Cepat RFQ
Tim penjualan kami akan merespon dalam 24 jam
Nomor PartMfrPkgKwantitasHarga Target
×
✓
Kutipan telah disubmit!

Kami akan membalas email Anda dalam 24 jam

Keranjang Belanja 0 item
Keranjang belanja Anda kosong
Kutipan Cepat RFQ
Isi detail lengkap — tim penjualan kami akan membalas dalam 24 jam
Nomor Part Manufaktur Paket QTY Harga Target Lengkap
✓
Kutipan telah disubmit!

Kami akan membalas email Anda dalam 24 jam

1
RFQ Dikirim
2
Kutipan Diterima
3
Order Ditempatkan
4
Pembayaran
5
Dikirim
6
Dikirim
Lihat Detil RFQ