10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel
MPN: 10M04SCE144A7G ✓ Hoạt động10M04SCE144A7G Tóm tắt
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior.
Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines.
Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges.
Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers.
When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths.
This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.
Bộ thay thế dễ dàng lắp đặt cho 10M04SCE144A7G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10M04SCE144A7G (cùng hình factor và footprint) — khác nhau ở Package, Configuration Memory, Logic Elements (LE), Speed Grade, Core Voltage.
10M04SCE144C8G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M04SCE144I7G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M08SCE144A7G
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
10M02SCE144A7G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M04DCU324A7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M04SCE144A7G Tỷ lệ tối đa & tính chất điện
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (RAM bits) | 193,536 |
| Number of Logic Cells | 4,000 |
| Number of User I/O Pins | 101 |
| Điện áp cung cấp hoạt động | 3.0 V / 3.3 V (single supply) |
| Hộp | 144-EQFP (LQFP with Exposed Pad), 20x20 mm |
| Kiểu lắp đặt | Surface Mount |
| Khoảng nhiệt độ hoạt động | -40 °C to +125 °C (automotive/industrial) |
| Configuration Memory | On-chip flash, non-volatile |
| Automotive Qualification | AEC-Q100 |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 |
| Speed Grade | 7 (lower-power tier within MAX 10 family) |
Cấu hình chân 10M04SCE144A7G
| Chân 1 | I/O — User I/O bank 1 |
| Chân 2 | I/O — User I/O bank 1 |
| Chân 3 | GND — Ground |
| Chân 4 | I/O — User I/O bank 1 |
| Chân 5 | I/O — User I/O bank 1 |
| Chân 6 | VCCIO1 — Bank 1 I/O supply |
| Chân 7 | I/O — User I/O bank 1 |
| Chân 8 | I/O — User I/O bank 1 |
| Chân 9 | I/O — User I/O bank 1 |
| Chân 10 | I/O — User I/O bank 1 |
| Chân 11 | I/O — User I/O bank 1 |
| Chân 12 | I/O — User I/O bank 1 |
| Chân 13 | GND — Ground |
| Chân 14 | I/O — User I/O bank 2 |
| Chân 15 | I/O — User I/O bank 2 |
| Chân 16 | VCCIO2 — Bank 2 I/O supply |
| Chân 17 | I/O — User I/O bank 2 |
| Chân 18 | I/O — User I/O bank 2 |
| Chân 19 | I/O — User I/O bank 2 |
| Chân 20 | GND — Ground |
| Chân 21 | I/O — User I/O bank 2 |
| Chân 22 | I/O — User I/O bank 2 |
| Chân 23 | I/O — User I/O bank 2 |
| Chân 24 | I/O — User I/O bank 2 |
| Chân 25 | GND — Ground |
| Chân 26 | I/O — User I/O bank 3 |
| Chân 27 | I/O — User I/O bank 3 |
| Chân 28 | VCCIO3 — Bank 3 I/O supply |
| Chân 29 | I/O — User I/O bank 3 |
| Chân 30 | I/O — User I/O bank 3 |
| Chân 31 | I/O — User I/O bank 3 |
| Chân 32 | I/O — User I/O bank 3 |
| Chân 33 | GND — Ground |
| Chân 34 | I/O — User I/O bank 4 |
| Chân 35 | I/O — User I/O bank 4 |
| Chân 36 | VCCIO4 — Bank 4 I/O supply |
| Chân 37 | I/O — User I/O bank 4 |
| Chân 38 | I/O — User I/O bank 4 |
| Chân 39 | I/O — User I/O bank 4 |
| Chân 40 | I/O — User I/O bank 4 |
| Chân 41 | GND — Ground |
| Chân 42 | I/O — User I/O bank 5 |
| Chân 43 | I/O — User I/O bank 5 |
| Chân 44 | VCCIO5 — Bank 5 I/O supply |
| Chân 45 | I/O — User I/O bank 5 |
| Chân 46 | I/O — User I/O bank 5 |
| Chân 47 | I/O — User I/O bank 5 |
| Chân 48 | I/O — User I/O bank 5 |
| Chân 49 | GND — Ground |
| Chân 50 | I/O — User I/O bank 6 |
| Chân 51 | I/O — User I/O bank 6 |
| Chân 52 | VCCIO6 — Bank 6 I/O supply |
| Chân 53 | I/O — User I/O bank 6 |
| Chân 54 | I/O — User I/O bank 6 |
| Chân 55 | I/O — User I/O bank 6 |
| Chân 56 | I/O — User I/O bank 6 |
| Chân 57 | GND — Ground |
| Chân 58 | I/O — User I/O bank 7 |
| Chân 59 | I/O — User I/O bank 7 |
| Chân 60 | VCCIO7 — Bank 7 I/O supply |
| Chân 61 | I/O — User I/O bank 7 |
| Chân 62 | I/O — User I/O bank 7 |
| Chân 63 | I/O — User I/O bank 7 |
| Chân 64 | I/O — User I/O bank 7 |
| Chân 65 | GND — Ground |
| Chân 66 | I/O — User I/O bank 8 |
| Chân 67 | I/O — User I/O bank 8 |
| Chân 68 | VCCIO8 — Bank 8 I/O supply |
| Chân 69 | I/O — User I/O bank 8 |
| Chân 70 | I/O — User I/O bank 8 |
| Chân 71 | I/O — User I/O bank 8 |
| Chân 72 | I/O — User I/O bank 8 |
| Chân 73 | GND — Ground |
| Chân 74 | TCK — JTAG test clock |
| Chân 75 | TMS — JTAG test mode select |
| Chân 76 | TDI — JTAG test data in |
| Chân 77 | TDO — JTAG test data out |
| Chân 78 | nCONFIG — Configuration control (active low) |
| Chân 79 | nSTATUS — Configuration status (active low) |
| Chân 80 | CONF_DONE — Configuration done |
| Chân 81 | DCLK — Configuration clock |
| Chân 82 | DATA0 — Configuration data input |
| Chân 83 | MSEL0 — Configuration mode select 0 |
| Chân 84 | MSEL1 — Configuration mode select 1 |
| Chân 85 | MSEL2 — Configuration mode select 2 |
| Chân 86 | VCCA — Analog supply for ADC/PLL |
| Chân 87 | VCCA_ADC — ADC analog supply |
| Chân 88 | REF_GND — Analog reference ground |
| Chân 89 | ADCIN1 — ADC analog input channel 1 |
| Chân 90 | ADCIN2 — ADC analog input channel 2 |
| Chân 91 | ADCIN3 — ADC analog input channel 3 |
| Chân 92 | ADCIN4 — ADC analog input channel 4 |
| Chân 93 | ADCIN5 — ADC analog input channel 5 |
| Chân 94 | ADCIN6 — ADC analog input channel 6 |
| Chân 95 | ADCIN7 — ADC analog input channel 7 |
| Chân 96 | ADCIN8 — ADC analog input channel 8 |
| Chân 97 | GND — Ground |
| Chân 98 | VCC — Core supply (3.0/3.3 V) |
| Chân 99 | VCC — Core supply (3.0/3.3 V) |
| Chân 100 | GND — Ground |
| Chân 101 | I/O — User I/O bank 1 |
| Chân 102 | I/O — User I/O bank 1 |
| Chân 103 | VCCIO1 — Bank 1 I/O supply |
| Chân 104 | I/O — User I/O bank 1 |
| Chân 105 | I/O — User I/O bank 1 |
| Chân 106 | I/O — User I/O bank 1 |
| Chân 107 | I/O — User I/O bank 1 |
| Chân 108 | GND — Ground |
| Chân 109 | I/O — User I/O bank 2 |
| Chân 110 | I/O — User I/O bank 2 |
| Chân 111 | VCCIO2 — Bank 2 I/O supply |
| Chân 112 | I/O — User I/O bank 2 |
| Chân 113 | I/O — User I/O bank 2 |
| Chân 114 | I/O — User I/O bank 2 |
| Chân 115 | I/O — User I/O bank 2 |
| Chân 116 | GND — Ground |
| Chân 117 | I/O — User I/O bank 3 |
| Chân 118 | I/O — User I/O bank 3 |
| Chân 119 | VCCIO3 — Bank 3 I/O supply |
| Chân 120 | I/O — User I/O bank 3 |
| Chân 121 | I/O — User I/O bank 3 |
| Chân 122 | I/O — User I/O bank 3 |
| Chân 123 | I/O — User I/O bank 3 |
| Chân 124 | GND — Ground |
| Chân 125 | I/O — User I/O bank 4 |
| Chân 126 | I/O — User I/O bank 4 |
| Chân 127 | VCCIO4 — Bank 4 I/O supply |
| Chân 128 | I/O — User I/O bank 4 |
| Chân 129 | I/O — User I/O bank 4 |
| Chân 130 | I/O — User I/O bank 4 |
| Chân 131 | I/O — User I/O bank 4 |
| Chân 132 | GND — Ground |
| Chân 133 | I/O — User I/O bank 5 |
| Chân 134 | I/O — User I/O bank 5 |
| Chân 135 | VCCIO5 — Bank 5 I/O supply |
| Chân 136 | I/O — User I/O bank 5 |
| Chân 137 | I/O — User I/O bank 5 |
| Chân 138 | I/O — User I/O bank 5 |
| Chân 139 | I/O — User I/O bank 5 |
| Chân 140 | GND — Ground |
| Chân 141 | I/O — User I/O bank 6 |
| Chân 142 | I/O — User I/O bank 6 |
| Chân 143 | VCCIO6 — Bank 6 I/O supply |
| Chân 144 | EP — Exposed thermal pad (must connect to GND pour) |
Ứng dụng tiêu biểu
10M04SCE144A7G phù hợp cho 6 Áp dụngs: Industrial Motor Control, Automotive Body and Chassis Controllers, I/O Expansion and Bridging for MCUs, Human-Machine Interface (HMI) and Display Control, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O.
Industrial Motor Control
The 10M04SCE144A7G fits industrial motor-control state machines where 4,000 LEs and 101 user I/O pins are sufficient to host position counters, PWM generators, and encoder interfaces. Its non-volatile flash configuration provides instant-on deterministic power-up, which is critical for safe stop sequences on 3-phase inverter boards. The AEC-Q100 automotive grade extends the same part to harsh industrial environments with -40 °C to +125 °C operation, and the 144-EQFP package simplifies SMT assembly on conventional lines.
Được đề xuất
Automotive Body and Chassis Controllers
The 10M04SCE144A7G suits body and chassis modules (BCM, HVAC, lighting controllers) because AEC-Q100 qualification, 4,000 LEs, and 193,536 bits of embedded flash allow the FPGA to replace multiple discrete logic ICs and small CPLDs. Dual-image flash supports fail-safe firmware updates required by ISO 26262 workflows. With 101 user I/O the device can drive LIN/CAN transceivers and high-side switches directly, simplifying PCB routing inside an EQFP footprint.
Được đề xuất
I/O Expansion and Bridging for MCUs
The 10M04SCE144A7G acts as a programmable I/O expander or bus bridge for legacy microcontrollers. Designers can implement parallel-to-SPI bridges, custom keypad scanners, or LVDS/TTL level translation in 4,000 LEs, then route 101 signals back to the host MCU through a single EQFP footprint. Non-volatile configuration eliminates the external boot flash that CPLD bridges otherwise need, reducing BOM cost and PCB area on industrial control boards.
Được đề xuất
Human-Machine Interface (HMI) and Display Control
The 10M04SCE144A7G drives simple HMI panels, segment LCDs, and small TFT displays by combining on-chip oscillators, dedicated user flash for frame buffers (193,536 bits), and 101 user I/O to connect touch sensors and keypads. AEC-Q100 qualification enables use in automotive instrument clusters and in-cabin infotainment sub-modules. The instant-on behavior of MAX 10 non-volatile flash eliminates the lag users experience with SRAM-based FPGAs.
Được đề xuất
Portable Medical and Wellness Devices
The 10M04SCE144A7G integrates sensor front-end glue logic for portable medical and wellness devices such as blood-pressure monitors, pulse oximeters, and home-diagnostic tools. The integrated MAX 10 ADC block and 4,000 LEs let designers digitize sensor channels, run digital filters, and drive a small display from a single chip. The 144-EQFP 20x20 mm footprint remains manageable for handheld enclosures while supporting a wide operating temperature window.
Được đề xuất
Industrial Sensor Aggregation and Edge I/O
The 10M04SCE144A7G aggregates multiple industrial sensors (temperature, pressure, flow) and forwards them to a host controller over EtherCAT, PROFINET, or serial protocols. With 101 user I/O and 4,000 LEs, the part handles timestamp counters, watchdog logic, and protocol stacks without external logic ICs. AEC-Q100 qualification supports deployments in factory automation cells where -40 °C to +125 °C swings are routine, and the 144-EQFP allows reflow on conventional lines.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10M04SCE144A7G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10M04SCE144C8G | 10M04SCE144I7G | 10M08SCE144A7G | 10M02SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-EQFP (20x20 mm) | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 (same) | 4,000 (same) | 8,000 (+100%) | 2,000 (-50%) |
| Operating Temperature | -40 °C to +125 °C (automotive) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) |
| Supply Voltage | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V |
| AEC-Q100 Automotive | Yes | No (commercial) | No (industrial) | Yes | Yes |
Bảo phân biệt quan trọng
- AEC-Q100 automotive grade with extended -40 to +125 °C temperature range (vs10M04SCE144C8G)
- Maximized logic capacity within the 144-EQFP footprint (vs10M02SCE144A7G)
- Higher LE count upgrade path on identical footprint (vs10M08SCE144A7G)
Ghi chú thiết kế
Estimated: at continuous 3.3 V VCC, 101 user I/O switching at 25% toggle and 10 MHz, internal power is dominated by I/O bank current. With a 144-EQFP theta_JA of approximately 25 °C/W on a 4-layer JEDEC board, internal dissipation must stay below ~1.6 W to keep junction rise under 40 °C above 85 °C ambient. Exposed pad must be soldered to a continuous GND copper pour on top and inner layers to meet this envelope.
Place 100 nF X7R bypass capacitors within 5 mm of every VCC and VCCIO pin, with one 4.7 uF bulk capacitor per supply rail. Decouple VCCA_ADC from VCCA through a ferrite bead for ADC accuracy. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups to VCCIO8 and short, length-matched traces to the programming header for reliable Quartus Prime configuration.
Do not leave the exposed pad (EP, pin 144) floating; it must be soldered to GND or thermal performance will degrade by 30-50% and AEC-Q100 qualification no longer applies. MSEL pins must match the desired configuration mode (AS, PS, JTAG) before VCC ramps, or the device will not boot. Avoid tying unused user I/O to long traces, which can act as antennas and inject noise into the ADC subsystem.
Route JTAG and configuration signals on the top layer adjacent to the device to keep stubs under 2 mm. Place the configuration flash (if used for dual-image) within 25 mm of DATA0/DCLK. Isolate ADC analog traces (ADCIN1-8, REF_GND) from digital switching traces; surround them with a GND guard ring connected to the analog ground plane to preserve ADC SNR.
Thông tin tuân thủ
AEC-Q100 automotive grade per Intel MAX 10 datasheet ordering information. RoHS compliant per JLCPCB listing. MSL 3 per JEDEC J-STD-020.
