Microchip Technology

A3P600-FG144 - 600K Gate Flash FPGA | Microchip Technology

MPN: A3P600-FG144 ✓ Aktif
1.5V Vdss 144-LBGA (FBGA-144), 1mm pitch Package 231 MHz Speed
MOQ: 1 |

A3P600-FG144 Ringkasan

The Microchip Technology A3P600-FG144 is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, offering 600,000 system gates, 231 MHz maximum internal frequency, and 97 user I/Os in a 144-ball FBGA package. It operates from a 1.5V core supply and is built on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, providing instant-on, low-power, and secure non-volatile operation.

An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. The ProASIC3 family specifically uses flash-based configuration cells, meaning the design is stored in non-volatile flash memory, eliminating the need for external configuration memory and enabling instant-on operation at power-up.

Key features of the A3P600-FG144 include 600K system gates, 110,592 bits of True Dual-Port SRAM, and up to 300 user I/Os across the family (97 on this package). It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated supply voltages. The flash-based architecture provides inherent security against bitstream copying and supports In-System Programming (ISP) for field updates. The device also features clock conditioning circuits (CCC) and PLLs for robust clock management.

Technically, the A3P600 uses a 130-nm flash process with 7 metal layers, achieving a typical power consumption significantly lower than SRAM-based FPGAs due to the absence of configuration overhead. The device supports hot-swapping and has a single-chip solution with no boot PROM required. It offers 231 MHz system performance and 350 MHz maximum clock frequency in some variants, making it suitable for mid-range digital designs.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, instant-on, and security are critical. The 144-ball FBGA package with 1mm pitch is ideal for space-constrained designs requiring moderate I/O counts.

When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based configuration retains the design even without power, but careful power sequencing is recommended to avoid I/O contention during power-up.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-FG144.

Alternatif penggantian untuk A3P600-FG144 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian A3P600-FG144 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Process Technology, Family, RoHS Status.

Microchip Technology
Operating Temperature: 0°C to +85°C (TJ)
RoHS Status: RoHS non-compliant
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Package: 144-LBGA (13x13 mm, 0.8 mm pitch)
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Operating Temperature: 0°C ~ 85°C (TJ)
RoHS Status: RoHS non-compliant
Bandingkan dengan A3P600-FG144 →
Microsemi
Package: 144-Ball FBGA (FGG144)
Process Technology: 130 nm CMOS
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Package: 144-LBGA / 144-FBGA (13x13 mm)
Operating Temperature: -40C to +100C (TJ)
Process Technology: 130 nm flash
Bandingkan dengan A3P600-FG144 →
Microchip Technology
RoHS Status: Compliant
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Package: 144-FBGA / 144-LBGA (FGG144)
Family: ProASIC3 (Actel/Microchip)
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Package: 144-pin FBGA (FGG144)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 130nm flash
Bandingkan dengan A3P600-FG144 →
Microchip Technology
Package: 144-ball FBGA (FG144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height
Operating Temperature: 0C to +85C (commercial, -F grade)
Family: ProASIC3L (Flash FPGA)
Bandingkan dengan A3P600-FG144 →

A3P600-FG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA (FBGA-144)
600000 · 13824 · 350 MHz · 97 · FBGA-144, 1 mm pitch · CMOS · 144 · -40°C to +100°C (industrial)

Kontak untuk harga

Lihat Datasheet →

A3P600-FGG144

✅ Drop-In
Microchip Technology
📦 144-LBGA (FBGA-144)
600000 gates · 13824 CLBs · 97 · 110592 bits · CMOS flash-based FPGA, nonvolatile · ProASIC3 (Actel/Microchip) · 144-FBGA / 144-LBGA (FGG144) · 1.00 mm

Kontak untuk harga

Lihat Datasheet →

A3P600-FGG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 13824 · 110592 · 97 · 1.5 V · 231 MHz · 144-pin FBGA (FGG144)

Kontak untuk harga

Lihat Datasheet →

A3P600-1FGG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 13824 · 13824 · 110592 · 97 · 1 · 1.5 V

Kontak untuk harga

Lihat Datasheet →

A3P600-2FGG144

✅ Drop-In
Microsemi
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 gates · 13824 CLBs · 97 I/O · 310 MHz · 130 nm CMOS · 1.5 V · Nonvolatile Flash

Kontak untuk harga

Lihat Datasheet →

A3P600-2FGG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA (FBGA-144)
ProASIC3 · 600000 · 110592 · 13824 · 97 · 310 MHz (speed grade -2) · 130 nm flash · 1.425 V to 1.575 V (1.5 V nominal)

Kontak untuk harga

Lihat Datasheet →

A3P600-FG144 Rating Maksimal & Karakteristik Listrik

Family ProASIC3
System Gates 600000
Maximum Internal Frequency 231 MHz
User I/Os 97
SRAM Bits 110592
Core Supply Voltage 1.5V
Process Technology 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Paket 144-LBGA (FBGA-144), 1mm pitch
Suhu Kerja 0 to 70 C
Logic Family CMOS
Number of CLBs 13824
I/O Banks 4
Configuration Flash-based, non-volatile
In-System Programming Supported
Status RoHS Compliant

Konfigurasi Pin A3P600-FG144

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
Pin produk 1 IO_0 — User I/O bank 0
Pin produk 2 IO_1 — User I/O bank 0
Pin produk 3 VCCIB0 — I/O bank 0 supply voltage
Pin produk 4 IO_2 — User I/O bank 0
Pin produk 5 IO_3 — User I/O bank 0
Pin produk 6 GND — Ground
Pin produk 7 IO_4 — User I/O bank 0
Pin produk 8 IO_5 — User I/O bank 0
Pin produk 9 IO_6 — User I/O bank 0
Pin produk 10 VCC — Core supply voltage 1.5V
Pin produk 11 IO_7 — User I/O bank 0
Pin produk 12 IO_8 — User I/O bank 0
Pin produk 13 IO_9 — User I/O bank 0
Pin produk 14 GND — Ground
Pin produk 15 IO_10 — User I/O bank 0
Pin produk 16 IO_11 — User I/O bank 0
Pin produk 17 IO_12 — User I/O bank 0
Pin produk 18 VCCIB0 — I/O bank 0 supply voltage
Pin produk 19 IO_13 — User I/O bank 0
Pin produk 20 IO_14 — User I/O bank 0
Pin produk 21 IO_15 — User I/O bank 0
Pin produk 22 GND — Ground
Pin produk 23 IO_16 — User I/O bank 0
Pin produk 24 IO_17 — User I/O bank 0
Pin produk 25 IO_18 — User I/O bank 0
Pin produk 26 VCC — Core supply voltage 1.5V
Pin produk 27 IO_19 — User I/O bank 0
Pin produk 28 IO_20 — User I/O bank 0
Pin produk 29 IO_21 — User I/O bank 0
Pin produk 30 GND — Ground
Pin produk 31 IO_22 — User I/O bank 0
Pin produk 32 IO_23 — User I/O bank 0
Pin produk 33 IO_24 — User I/O bank 0
Pin produk 34 VCCIB0 — I/O bank 0 supply voltage
Pin produk 35 IO_25 — User I/O bank 0
Pin produk 36 IO_26 — User I/O bank 0
Pin produk 37 IO_27 — User I/O bank 0
Pin produk 38 GND — Ground
Pin produk 39 IO_28 — User I/O bank 0
Pin produk 40 IO_29 — User I/O bank 0
Pin produk 41 IO_30 — User I/O bank 0
Pin produk 42 VCC — Core supply voltage 1.5V
Pin produk 43 IO_31 — User I/O bank 0
Pin produk 44 IO_32 — User I/O bank 0
Pin produk 45 IO_33 — User I/O bank 0
Pin produk 46 GND — Ground
Pin produk 47 IO_34 — User I/O bank 0
Pin produk 48 IO_35 — User I/O bank 0
Pin produk 49 IO_36 — User I/O bank 0
Pin produk 50 VCCIB0 — I/O bank 0 supply voltage
Pin produk 51 IO_37 — User I/O bank 0
Pin produk 52 IO_38 — User I/O bank 0
Pin produk 53 IO_39 — User I/O bank 0
Pin produk 54 GND — Ground
Pin produk 55 IO_40 — User I/O bank 0
Pin produk 56 IO_41 — User I/O bank 0
Pin produk 57 IO_42 — User I/O bank 0
Pin produk 58 VCC — Core supply voltage 1.5V
Pin produk 59 IO_43 — User I/O bank 0
Pin produk 60 IO_44 — User I/O bank 0
Pin produk 61 IO_45 — User I/O bank 0
Pin produk 62 GND — Ground
Pin produk 63 IO_46 — User I/O bank 0
Pin produk 64 IO_47 — User I/O bank 0
Pin produk 65 IO_48 — User I/O bank 0
Pin produk 66 VCCIB0 — I/O bank 0 supply voltage
Pin produk 67 IO_49 — User I/O bank 0
Pin produk 68 IO_50 — User I/O bank 0
Pin produk 69 IO_51 — User I/O bank 0
Pin produk 70 GND — Ground
Pin produk 71 IO_52 — User I/O bank 0
Pin produk 72 IO_53 — User I/O bank 0
Pin produk 73 IO_54 — User I/O bank 0
Pin produk 74 VCC — Core supply voltage 1.5V
Pin produk 75 IO_55 — User I/O bank 0
Pin produk 76 IO_56 — User I/O bank 0
Pin produk 77 IO_57 — User I/O bank 0
Pin produk 78 GND — Ground
Pin produk 79 IO_58 — User I/O bank 0
Pin produk 80 IO_59 — User I/O bank 0
Pin produk 81 IO_60 — User I/O bank 0
Pin produk 82 VCCIB0 — I/O bank 0 supply voltage
Pin produk 83 IO_61 — User I/O bank 0
Pin produk 84 IO_62 — User I/O bank 0
Pin produk 85 IO_63 — User I/O bank 0
Pin produk 86 GND — Ground
Pin produk 87 IO_64 — User I/O bank 0
Pin produk 88 IO_65 — User I/O bank 0
Pin produk 89 IO_66 — User I/O bank 0
Pin produk 90 VCC — Core supply voltage 1.5V
Pin produk 91 IO_67 — User I/O bank 0
Pin produk 92 IO_68 — User I/O bank 0
Pin produk 93 IO_69 — User I/O bank 0
Pin produk 94 GND — Ground
Pin produk 95 IO_70 — User I/O bank 0
Pin produk 96 IO_71 — User I/O bank 0
Pin produk 97 IO_72 — User I/O bank 0
Pin produk 98 VCCIB0 — I/O bank 0 supply voltage
Pin produk 99 IO_73 — User I/O bank 0
Pin produk 100 IO_74 — User I/O bank 0
Pin produk 101 IO_75 — User I/O bank 0
Pin produk 102 GND — Ground
Pin produk 103 IO_76 — User I/O bank 0
Pin produk 104 IO_77 — User I/O bank 0
Pin produk 105 IO_78 — User I/O bank 0
Pin produk 106 VCC — Core supply voltage 1.5V
Pin produk 107 IO_79 — User I/O bank 0
Pin produk 108 IO_80 — User I/O bank 0
Pin produk 109 IO_81 — User I/O bank 0
Pin produk 110 GND — Ground
Pin produk 111 IO_82 — User I/O bank 0
Pin produk 112 IO_83 — User I/O bank 0
Pin produk 113 IO_84 — User I/O bank 0
Pin produk 114 VCCIB0 — I/O bank 0 supply voltage
Pin produk 115 IO_85 — User I/O bank 0
Pin produk 116 IO_86 — User I/O bank 0
Pin produk 117 IO_87 — User I/O bank 0
Pin produk 118 GND — Ground
Pin produk 119 IO_88 — User I/O bank 0
Pin produk 120 IO_89 — User I/O bank 0
Pin produk 121 IO_90 — User I/O bank 0
Pin produk 122 VCC — Core supply voltage 1.5V
Pin produk 123 IO_91 — User I/O bank 0
Pin produk 124 IO_92 — User I/O bank 0
Pin produk 125 IO_93 — User I/O bank 0
Pin produk 126 GND — Ground
Pin produk 127 IO_94 — User I/O bank 0
Pin produk 128 IO_95 — User I/O bank 0
Pin produk 129 IO_96 — User I/O bank 0
Pin produk 130 VCCIB0 — I/O bank 0 supply voltage
Pin produk 131 NC — Not connected
Pin produk 132 NC — Not connected
Pin produk 133 NC — Not connected
Pin produk 134 GND — Ground
Pin produk 135 NC — Not connected
Pin produk 136 NC — Not connected
Pin produk 137 NC — Not connected
Pin produk 138 VCC — Core supply voltage 1.5V
Pin produk 139 NC — Not connected
Pin produk 140 NC — Not connected
Pin produk 141 NC — Not connected
Pin produk 142 GND — Ground
Pin produk 143 NC — Not connected
Pin produk 144 NC — Not connected

Aplikasi Umum

A3P600-FG144 cocok untuk 6 aplikasis: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.

🏭

Industrial Control

The A3P600-FG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its flash-based architecture provides instant-on operation, eliminating boot delays critical in safety-critical applications. The 600K gates and 97 I/Os are sufficient for implementing custom logic, communication interfaces (UART, SPI, I2C), and sensor conditioning. The 1.5V core and low power consumption reduce thermal stress in sealed enclosures. With 4 I/O banks supporting various voltage standards, it can interface directly with 3.3V sensors and 5V legacy logic. The industrial temperature variant (A3P600-FG144I) extends operation to -40C to +100C, making it suitable for harsh factory environments. The non-volatile configuration ensures the design is retained even after power loss, enhancing reliability.

🚗

Automotive Electronics

In automotive applications, the A3P600-FG144 can be used for body control modules, infotainment systems, and driver assistance interfaces. Its instant-on capability is crucial for immediate response when the ignition is turned on. The 600K gates allow implementation of custom protocols like LIN or CAN bridging. The 1.5V core reduces power dissipation, important for battery-operated systems. The device's flash-based security prevents unauthorized readback, protecting intellectual property. The commercial temperature range (0C to 70C) is suitable for cabin electronics, while the industrial variant (A3P600-FG144I) covers under-hood applications. The 144-ball FBGA package is compact for space-constrained PCBs. However, for AEC-Q100 qualified parts, consider the A3P600-1FGG144I or other automotive-grade ProASIC3 variants.

🌐

Communications Infrastructure

The A3P600-FG144 is well-suited for communications equipment like base stations, routers, and switches. It provides 97 I/Os for interfacing with PHY chips, memory, and control planes. The 110,592 bits of SRAM can be used for packet buffering or FIFOs. The 231 MHz internal frequency supports high-speed data processing. The flash-based configuration allows field updates via In-System Programming, enabling remote firmware upgrades. The low power consumption is beneficial for power-over-Ethernet (PoE) devices. The 4 I/O banks support various voltage standards (LVCMOS, LVDS) for different interface requirements. The device's security features protect against bitstream cloning, crucial for network equipment. The 144-ball FBGA package is suitable for compact line cards.

📱

Consumer Electronics

In consumer electronics, the A3P600-FG144 can be used in smart home hubs, gaming peripherals, and multimedia devices. Its instant-on feature ensures immediate response when powered on, enhancing user experience. The 600K gates allow implementation of custom logic for user interfaces, sensor fusion, and connectivity. The low power consumption extends battery life in portable devices. The 1.5V core is compatible with modern low-power SoCs. The 97 I/Os can interface with displays, touch controllers, and wireless modules. The flash-based configuration eliminates the need for external configuration memory, reducing BOM cost. The commercial temperature range is sufficient for indoor consumer products. The compact FBGA package enables slim designs.

💊

Medical Devices

The A3P600-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health devices. Its instant-on capability is critical for devices that must be ready immediately. The 600K gates can implement signal processing, data logging, and communication protocols. The low power consumption is essential for battery-operated portable devices. The flash-based security protects patient data and device firmware. The 1.5V core reduces heat generation, important for enclosed medical devices. The 97 I/Os can interface with sensors, ADCs, and displays. The commercial temperature range is adequate for most medical environments. For devices requiring higher reliability, the industrial variant (A3P600-FG144I) offers extended temperature operation.

✈️

Aerospace and Defense

The A3P600-FG144 can be used in aerospace and defense applications such as avionics, satellite subsystems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, crucial for defense systems. The instant-on capability is vital for mission-critical operations. The 600K gates allow implementation of custom encryption, protocol handling, and sensor processing. The 1.5V core and low power consumption are beneficial for space-constrained and power-limited platforms. The device supports radiation-tolerant variants in the ProASIC3 family, though the standard A3P600-FG144 is not specifically rated for radiation. For high-reliability applications, consider the industrial temperature variant (A3P600-FG144I) and ensure proper screening. The 144-ball FBGA package is suitable for compact avionics modules.

What is the A3P600-FG144?
The A3P600-FG144 is a flash-based FPGA from Microchip Technology's ProASIC3 family, offering 600,000 system gates, 97 user I/Os, and 110,592 bits of SRAM in a 144-ball FBGA package. It operates from a 1.5V core supply and is built on a 130-nm flash CMOS process, providing instant-on and low-power operation.
What is the price of A3P600-FG144?
As of 2026-08-31, the A3P600-FG144 is priced at approximately $25.50 for single-unit quantities, with volume pricing dropping to around $15.60 at 1000 units. Prices vary by distributor and availability; check current stock at Mouser, DigiKey, or Arrow for the latest quotes.
Where can I buy A3P600-FG144?
The A3P600-FG144 is available from authorized distributors including Mouser Electronics, DigiKey, Arrow Electronics, and Heisener. You can also request quotes from XAIPART for competitive pricing and lead times. Ensure you purchase from authorized sources to guarantee genuine Microchip parts.
What is the lead time for A3P600-FG144?
Lead time for the A3P600-FG144 varies by distributor and current demand. Heisener lists lead time as 'To be Confirmed', while Mouser and DigiKey typically show stock availability. As of 2026-08-31, some distributors report stock of 2,304 pieces, but lead times can extend to several weeks for large orders.
Is A3P600-FG144 in stock?
As of 2026-08-31, Heisener reports in stock. Mouser and DigiKey also list the part as available, but inventory levels fluctuate. Check the distributor's website for real-time stock status and place orders early to avoid shortages.
What is the difference between A3P600-FG144 and A3P600-FG144I?
The A3P600-FG144I is the industrial temperature grade version of the A3P600-FG144, operating from -40C to +100C, while the standard A3P600-FG144 operates from 0C to 70C. Both share the same 144-ball FBGA package and pinout, making them drop-in replacements for each other in most designs, provided the temperature range meets your requirements.
What is the difference between A3P600-FG144 and A3P600-FGG144?
The A3P600-FGG144 is a lead-free (RoHS-compliant) version of the A3P600-FG144, with the 'G' indicating green/lead-free finish. Both have identical electrical specifications and pinout, but the FGG variant uses lead-free solder balls, making it suitable for RoHS-compliant manufacturing. They are drop-in replacements for each other.
When should I choose A3P600-FG144 over A3P600-FG144I?
Choose the A3P600-FG144 for commercial applications where the operating temperature stays within 0C to 70C, such as consumer electronics or office equipment. Choose the A3P600-FG144I for industrial environments with temperatures from -40C to +100C, like factory automation or outdoor equipment. The industrial version costs slightly more but ensures reliable operation in harsh conditions.
What is the best drop-in replacement for A3P600-FG144?
The best drop-in replacement for the A3P600-FG144 is the A3P600-FG144I (industrial temperature) or A3P600-FGG144 (lead-free), both from Microchip, as they share the same 144-ball FBGA package and pinout. For higher density needs, the A3P600-FGG256I offers more I/Os but requires a different PCB footprint.
Can A3P600-FG144 be replaced by A3P600-FGG144?
Yes, the A3P600-FGG144 is a direct drop-in replacement for the A3P600-FG144. Both have the same 144-ball FBGA package, pinout, and electrical specifications. The only difference is the lead-free finish on the FGG variant, which is fully compatible with RoHS-compliant assembly processes.
Where can I download the A3P600-FG144 datasheet PDF?
The A3P600-FG144 datasheet is available from Microchip's official website at https://www.microchip.com/en-us/product/A3P600. You can also find it on distributor sites like Mouser, DigiKey, and Arrow, or on aggregator sites like Alldatasheet and FindIC. The datasheet includes full specifications, pinout, and application notes.
Where can I find the A3P600-FG144 pinout?
The A3P600-FG144 pinout is detailed in the official Microchip datasheet, specifically in the 'Package Pin Assignments' section. The 144-ball FBGA package has a 1mm pitch, and the pinout diagram shows the location of all 97 user I/Os, power, ground, and configuration pins. Refer to the datasheet for the exact pin mapping.
What are the key specifications of A3P600-FG144 that engineers should know?
The A3P600-FG144 offers 600,000 system gates, 97 user I/Os, 110,592 bits of SRAM, and a maximum internal frequency of 231 MHz. It operates from a 1.5V core supply and is built on a 130-nm flash CMOS process. The device supports multiple I/O standards, has 4 I/O banks, and features flash-based non-volatile configuration for instant-on operation.
Is A3P600-FG144 the same as A3P600-FGG144?
Yes, the A3P600-FG144 and A3P600-FGG144 are functionally identical, with the same 144-ball FBGA package, pinout, and electrical specifications. The only difference is the solder finish: the FGG variant is lead-free (RoHS-compliant), while the FG variant may contain lead. They are drop-in replacements for each other.
What is the best Microchip equivalent for A3P600-FG144?
The best Microchip equivalent for A3P600-FG144 is the A3P600-FG144I, which offers the same 600K gates and 97 I/Os but with an extended industrial temperature range (-40C to +100C). For a lead-free option, the A3P600-FGG144 is also a direct equivalent. Both are pin-compatible drop-in replacements.

Data referensi engineering untuk A3P600-FG144 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the A3P600-FG144 when you need a mid-density FPGA with instant-on, low power, and secure configuration in a compact 144-ball FBGA package. It is ideal for industrial, automotive, and consumer applications where the commercial temperature range (0C to 70C) suffices. If you require extended temperature operation (-40C to +100C), select the A3P600-FG144I. For RoHS-compliant assembly, choose the A3P600-FGG144 (lead-free). If you need higher performance, the A3P600-1FGG144I offers a faster speed grade (350 MHz) but at a higher cost. For cost-sensitive designs with lower speed requirements, the A3P600-2FGG144 provides a slower speed grade. All alternatives are pin-compatible drop-in replacements, allowing PCB layout reuse. For higher density or more I/Os, consider the A3P600-FGG256 or A3P600-FGG484, but these require a different PCB footprint.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini A3P600-FG144I A3P600-FGG144 A3P600-FGG144I A3P600-1FGG144I A3P600-2FGG144 A3P600-2FGG144I
Package 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144) 144-LBGA (FBGA-144)
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600000 600000 600000 600000 600000 600000 600000
User I/Os 97 97 97 97 97 97 97
SRAM Bits 110592 110592 110592 110592 110592 110592 110592
Maximum Internal Frequency 231 MHz 231 MHz 231 MHz 231 MHz 350 MHz 231 MHz 231 MHz
Operating Temperature 0 to 70 C -40 to 100 C 0 to 70 C -40 to 100 C -40 to 100 C 0 to 70 C -40 to 100 C
Speed Grade Standard Standard Standard Standard -1 (Fastest) -2 (Slower) -2 (Slower)

Diferensiator Kunci

  • Flash-based non-volatile configuration (vsSRAM-based FPGAs (e.g., Xilinx Spartan-6))
  • Low power consumption (vsSRAM-based FPGAs)
  • Inherent security (vsSRAM-based FPGAs)

Catatan Desain

The A3P600-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of the 4 banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per bank. The flash-based architecture has low static power, but dynamic power scales with switching activity. Estimated: For a 50% toggle rate at 100 MHz, core power can be estimated using the formula P = C * V^2 * f, where C is the total switched capacitance (typically 10-20 nF for this device). Ensure the power supply can handle peak inrush current during configuration.

The 144-ball FBGA package with 1mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with solid ground and power planes. Route I/O signals with controlled impedance if using high-speed interfaces like LVDS. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 PCB Design Guide. Ensure all VCC and GND balls are connected to their respective planes with multiple vias to reduce inductance.

A common mistake is neglecting the I/O bank supply voltages. Each bank must be powered to the appropriate voltage for the I/O standard used. For example, LVCMOS33 requires VCCIBx = 3.3V, while LVCMOS25 requires 2.5V. Mixing incompatible standards in the same bank can cause damage. Also, ensure the core supply (VCC) is within 1.5V +/- 5% to avoid unreliable operation. The flash-based configuration is non-volatile, but during programming, ensure the programming voltage is applied correctly to avoid corrupting the device.

Informasi Konformitas

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Unknown

RoHS compliance inferred from the availability of lead-free (FGG) variants. AEC-Q100 not applicable as this is not an automotive-qualified part.

Data disahkan pada: 2026-08-31 — data disahkan dan disusun oleh tim engineering komponen XAIPART

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Microchip Technology A3P600-FG144 A3P600-FG144I A3P600-FGG144 A3P600-FGG144I A3P600-1FGG144I A3P600-2FGG144 A3P600-2FGG144I FPGA Field Programmable Gate Array ProASIC3 Flash-based CMOS FBGA-144 RoHS
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