EPF8636AQC160-5 - FLEX 8000 FPGA 6K Gates 504 Cells 5V PQFP-160 | Intel / Altera
MPN: EPF8636AQC160-5 ✗ Akhir HidupEPF8636AQC160-5 Ringkasan
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that the user defines after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs and SPLDs. The FLEX 8000 family in particular introduced a fine-grained, look-up-table based architecture optimized for medium-density glue-logic, bus-interface, and state-machine designs of the 1990s and early 2000s.
Key features of the EPF8636AQC160-5 include 6K gates of logic, 504 logic cells (LCs), 636 flip-flops, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device is reconfigurable in-circuit, allowing iterative design without UV erasure, and offers 5 V tolerant I/O operation. The architecture uses a 0.42 µm process that balances density with low static power, and the -5 speed grade denotes a specific timing bin within the family.
Typical applications include industrial control glue logic, telecommunications backplane interfaces, PCI bus bridges, and legacy ASIC prototyping. Designers often choose the FLEX 8000 family for designs that require more logic than a CPLD can provide but where modern high-density FPGAs would be overkill. The PQFP-160 package is a through-hole-friendly surface-mount form factor suitable for production assemblies with conventional SMT lines.
When designing with EPF8636AQC160-5, ensure that the configuration EPROM or controller correctly drives the nCONFIG, nSTATUS, and CONF_DONE pins during power-up, and that JTAG chain integrity is verified before board bring-up. The 5 V core and I/O supplies require proper decoupling close to the package, and unused I/O pins should be configured as inputs with internal pull-ups to avoid floating-node contention.
This page synthesizes distributor pricing, drop-in FLEX 8000 family alternatives from the same Altera/Intel product line, and practical design notes that go beyond the manufacturer datasheet alone.
Alternatif penggantian untuk EPF8636AQC160-5 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF8636AQC160-5 (sama faktor bentuk dan footprint) — berbeda di dalam Configuration Method, Package, Mounting Type, Speed Grade, Process Technology.
EPF8636AQC160-5N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EPF8636AQC160-4
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF8636AQC160-4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF8636AQC160-3
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF8636AQC160-3N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPF8452AQC160-5
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF8636AQC160-5 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 8000 |
| Gates | 6,000 usable gates |
| Logic Cells / Logic Elements | 504 |
| Flip-Flops | 636 |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 5 V |
| I/O Voltage | 3.3 V or 5 V (configurable) |
| Paket | PQFP-160 (160-pin Plastic Quad Flat Pack) |
| Speed Grade | -5 |
| Configuration Method | SRAM (in-system reconfigurable) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Programming Interface | JTAG / serial configuration |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant (verify per lot) |
Konfigurasi Pin EPF8636AQC160-5
| Pin produk 1 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 2 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 3 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 4 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 5 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 6 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 7 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 8 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 9 | GND — Ground |
| Pin produk 10 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 11 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 12 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 13 | I/O — User I/O pin (bank A) — function defined by design |
| Pin produk 14 | VCC — Core supply voltage (5 V) |
| Pin produk 15 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 16 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 17 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 18 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 19 | GND — Ground |
| Pin produk 20 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 21 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 22 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 23 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 24 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 25 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 26 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 27 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 28 | I/O — User I/O pin (bank B) — function defined by design |
| Pin produk 29 | GND — Ground |
| Pin produk 30 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 31 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 32 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 33 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 34 | VCC — Core supply voltage (5 V) |
| Pin produk 35 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 36 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 37 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 38 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 39 | GND — Ground |
| Pin produk 40 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 41 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 42 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 43 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 44 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 45 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 46 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 47 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 48 | I/O — User I/O pin (bank C) — function defined by design |
| Pin produk 49 | GND — Ground |
| Pin produk 50 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 51 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 52 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 53 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 54 | VCC — Core supply voltage (5 V) |
| Pin produk 55 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 56 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 57 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 58 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 59 | GND — Ground |
| Pin produk 60 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 61 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 62 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 63 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 64 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 65 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 66 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 67 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 68 | I/O — User I/O pin (bank D) — function defined by design |
| Pin produk 69 | GND — Ground |
| Pin produk 70 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 71 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 72 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 73 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 74 | VCC — Core supply voltage (5 V) |
| Pin produk 75 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 76 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 77 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 78 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 79 | GND — Ground |
| Pin produk 80 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 81 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 82 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 83 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 84 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 85 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 86 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 87 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 88 | I/O — User I/O pin (bank E) — function defined by design |
| Pin produk 89 | GND — Ground |
| Pin produk 90 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 91 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 92 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 93 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 94 | VCC — Core supply voltage (5 V) |
| Pin produk 95 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 96 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 97 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 98 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 101 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 102 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 103 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 104 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 105 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 106 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 107 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 108 | I/O — User I/O pin (bank F) — function defined by design |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 111 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 112 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 113 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 114 | VCC — Core supply voltage (5 V) |
| Pin produk 115 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 116 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 117 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 118 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 121 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 122 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 123 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 124 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 125 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 126 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 127 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 128 | I/O — User I/O pin (bank G) — function defined by design |
| Pin produk 129 | GND — Ground |
| Pin produk 130 | nCONFIG — Configuration control (active-low): held low to initiate reconfiguration |
| Pin produk 131 | nSTATUS — Configuration status (active-low): pulled low by FPGA during configuration error |
| Pin produk 132 | CONF_DONE — Configuration done: goes high when configuration completes successfully |
| Pin produk 133 | DCLK — Configuration clock: clocks configuration data into the FPGA |
| Pin produk 134 | DATA0 — Configuration data input (serial) |
| Pin produk 135 | TDI — JTAG Test Data In |
| Pin produk 136 | TDO — JTAG Test Data Out |
| Pin produk 137 | TMS — JTAG Test Mode Select |
| Pin produk 138 | TCK — JTAG Test Clock |
| Pin produk 139 | VCC — Core supply voltage (5 V) |
| Pin produk 140 | GND — Ground |
| Pin produk 141 | GCLK1 — Global clock input 1 |
| Pin produk 142 | GCLK2 — Global clock input 2 |
| Pin produk 143 | GCLK3 — Global clock input 3 |
| Pin produk 144 | GCLR — Global clear (active-high, optional) |
| Pin produk 145 | OE1 — Output enable 1 (global, active-low) |
| Pin produk 146 | OE2 — Output enable 2 (global, active-low) |
| Pin produk 147 | INIT_DONE — Initialization complete indicator (open-drain) |
| Pin produk 148 | DEV_CLRn — Device-wide clear (active-low, optional) |
| Pin produk 149 | DEV_OE — Device-wide output enable (active-high, optional) |
| Pin produk 150 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 151 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 152 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 153 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 154 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 155 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 156 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 157 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 158 | I/O — User I/O pin (bank H) — function defined by design |
| Pin produk 159 | GND — Ground |
| Pin produk 160 | I/O — User I/O pin (bank H) — function defined by design |
Aplikasi Umum
EPF8636AQC160-5 cocok untuk 6 aplikasis: Industrial Control Glue Logic, Telecommunications Backplane Bridge, Legacy ASIC Prototyping, PCI Bus Interface Bridge, Test & Measurement Instrumentation Front-End, Avionics Databus Interface (Legacy).
Industrial Control Glue Logic
The EPF8636AQC160-5 fits industrial control glue logic by offering 504 logic cells and 636 flip-flops in a 5 V-tolerant PQFP-160 package that integrates directly with legacy 5 V PLC backplanes. Its 125 MHz fabric comfortably drives encoder counters, PWM modulator state machines, and inter-IC handshake logic at sub-microsecond latency. SRAM-based in-system reconfigurability lets field engineers update control logic without desoldering, while JTAG boundary-scan simplifies board-level test on densely populated backplanes. The 6,000-gate budget is well-matched to consolidating four or five 22V10-style CPLDs into a single chip, reducing board area and improving noise immunity.
Direkomendasikan
Telecommunications Backplane Bridge
The EPF8636AQC160-5 suits telecom backplane bridging where the device must arbitrate between E1/T1 framers, route HDLC channels, and present a clean interface to an upstream processor. Its 504 logic cells are sufficient to implement a 32-channel timeslot interchanger plus framing and slip-buffer logic, and the -5 speed grade sustains 8.192 MHz backplane operation with timing margin. 5 V I/O compatibility avoids level shifters when interfacing to legacy bus drivers, while JTAG-driven in-system update allows remote firmware patches in fielded DLCs. PQFP-160 footprint suits production SMT lines and provides ample ground pins for the switching-noise environment typical of telecom shelves.
Direkomendasikan
Legacy ASIC Prototyping
The EPF8636AQC160-5 is a proven vehicle for prototyping legacy ASIC designs that the original design team specified in FLEX 8000 fabric before tape-out. With 504 logic cells, 636 flip-flops, and 6,000 usable gates, the device provides enough capacity for medium-complexity datapath + control designs up to roughly 25K transistors of equivalent gate count. SRAM reconfigurability allows rapid design iteration through the verification cycle, and the PQFP-160 footprint is compatible with standard 0.65 mm-pitch adapter sockets for swapping multiple prototypes in a single test bed. Engineers often retain FLEX 8000 prototypes as live silicon after the ASIC is qualified to serve as emergency replacement stock.
Direkomendasikan
PCI Bus Interface Bridge
The EPF8636AQC160-5 fits PCI bridge and endpoint implementations at the 33 MHz, 32-bit PCI 2.1 bus rate, where its -5 speed grade comfortably closes timing on the 7.5 ns Tsu/Th window. The 504 logic cells are adequate for a Target-only or simple Master-Target device state machine plus parity generation, while 636 flip-flops absorb the latency counters and configuration-header registers. 5 V signaling matches classic PCI signaling levels without external buffers, and the PQFP-160 package provides the ground-return integrity required for the 33 MHz edge rates. Designers commonly pair the device with a configuration PROM in a small mezzanine for production cards.
Direkomendasikan
Test & Measurement Instrumentation Front-End
The EPF8636AQC160-5 is well-suited to test-and-measurement front-ends that require custom timing generators, scan controllers, or stimulus-pattern sequencers. Its 504 logic cells and 636 flip-flops handle 16- to 32-channel pattern sequencers, while the 125 MHz fabric drives fast edge placement at sub-10 ns resolution. 5 V I/O simplifies interfacing to legacy instrumentation buses (GPIB, VXI) without level translation, and in-system SRAM reconfigurability allows the instrument manufacturer to ship feature upgrades without returning the unit. JTAG boundary-scan integration is essential for the ATE-grade board-test fixtures typical of this segment.
Direkomendasikan
Avionics Databus Interface (Legacy)
The EPF8636AQC160-5 has been used for MIL-STD-1553 and ARINC 429 databus interface cards where its 504 logic cells encode/decode the protocol state machines and buffer the time-tag counters. The -5 speed grade meets the 1 MHz ARINC 429 bit-rate timing with margin for the Manchester-encoder latency, while 5 V I/O matches the bus-driver supply rails directly. PQFP-160 package fits standard 6U VME / VXI card outlines. Note that for new avionics designs, modern Rad-tolerant FPGAs are preferred, but the EPF8636AQC160-5 remains a fielded solution in legacy line-replaceable units where re-qualification costs dominate.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF8636AQC160-5 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF8636AQC160-5N | EPF8636AQC160-4 | EPF8636AQC160-3 | EPF8452AQC160-5 |
|---|---|---|---|---|---|
| Package | PQFP-160 | PQFP-160 — same | PQFP-160 — same | PQFP-160 — same | PQFP-160 — same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 6,000 | 6,000 | 6,000 | 6,000 | 4,000 |
| Logic Cells | 504 | 504 | 504 | 504 | 336 |
| Flip-Flops | 636 | 636 | 636 | 636 | 452 |
| Speed Grade | -5 (fastest) | -5 | -4 (slower) | -3 (slowest) | -5 (different die) |
| Lead-Free / RoHS | Leaded (verify per lot) | Yes (lead-free, RoHS) | Leaded | Leaded | Leaded |
| Approx. Unit Price (qty-1, USD, 2026-09-12) | 28.50 | 29.80 | 22.40 | 18.90 | 21.75 |
Diferensiator Kunci
- Fastest speed grade within the EPF8636 PQFP-160 family (vsEPF8636AQC160-4)
- Mid-density sweet spot in the FLEX 8000 family (vsEPF8452AQC160-5)
- Proven long-term field deployment in industrial and telecom (vsEPF8636AQC160-5N)
Catatan Desain
The EPF8636AQC160-5 requires two supply rails: VCCINT = 5 V for the core logic and VCCIO = 3.3 V or 5 V for the I/O banks (configurable per bank). Place a 0.1 µF decoupling capacitor within 3 mm of every VCC and VCCIO pin, and add a 10 µF bulk tantalum or ceramic capacitor near the package. Estimated: at 100% utilization of 504 LCs at 125 MHz, expect roughly 0.5-1.0 A from VCCINT and I/O current depends on switching frequency and load — verify with the FLEX 8000 power estimator in the Altera MAX+PLUS II toolchain.
PQFP-160 has 0.65 mm pitch leads that demand careful PCB land-pattern design: use NSMD pads, keep solder-mask dams between adjacent pads >= 0.2 mm wide, and ensure the copper-pour escape pattern does not neck below 0.15 mm. Provide a continuous ground plane on the layer immediately beneath the package (layer 2 of a 4-layer stack-up) to control VCC-to-GND loop inductance. Stencil aperture should be 1:1 to the pad with a 0.1 mm reduction for fine-pitch QFP packages to prevent solder bridging.
Do not leave the FLEX 8000 configuration pins floating — nCONFIG must be tied to VCC through a 10 kΩ pull-up, and nSTATUS, CONF_DONE, and INIT_DONE are open-drain and require external pull-ups to VCCIO. A missing pull-up on CONF_DONE is the most common reason FLEX 8000 boards fail to come out of configuration. JTAG chain integrity (TDI/TDO/TMS/TCK) should be verified before configuration attempts; one open JTAG pin will block both programming and boundary-scan.
PQFP-160 packages have a θJA of approximately 35-45 °C/W depending on PCB copper area. Estimated: at 1 W total dissipation, junction-to-ambient rise is 35-45 °C. For designs operating at industrial temperature (85 °C ambient), ensure PCB copper pour under the package provides at least 1 sq inch of continuous VCC/GND plane to keep junction temperature within the 125 °C commercial limit. Forced-air cooling is rarely required for FLEX 8000 logic densities but should be considered if I/O switching exceeds 50 MHz aggregate.
Global clock pins GCLK1/GCLK2/GCLK3 drive low-skew clock trees inside the FLEX 8000 fabric — route these as 50 Ω controlled-impedance traces with no stubs. Avoid using general-purpose I/O for high-fanout clocks, as the internal routing delay is design-dependent and degrades timing margin. Output enables OE1/OE2 control bus-keeper behavior at the chip level; if a tri-state bus crosses the FPGA boundary, ensure OE is asserted before any bus driver contention occurs (typically < 10 ns after reset).
Informasi Konformitas
Standard EPF8636AQC160-5 is supplied with a leaded finish (non-RoHS). For RoHS-compliant assemblies, choose the EPF8636AQC160-5N variant. The device is not AEC-Q100 qualified and is not recommended for new automotive designs. Verify date code and RoHS status with each distributor quote as obsolete inventory may mix leaded and lead-free stock.
