Intel

EPF8636AQC160-5 - FLEX 8000 FPGA 6K Gates 504 Cells 5V PQFP-160 | Intel / Altera

MPN: EPF8636AQC160-5 ✗ انتهى عمره الإنتاجي

5 V Vdss PQFP-160 (160-pin Plastic Quad Flat Pack) Package 125 MHz Speed

طلب عرض سعر

الحد الأدنى للطلب: 1 |

عرض ورقة البيانات (PDF) عرض البدائل

الكمية

EPF8636AQC160-5 نظرة عامة

The Intel / Altera EPF8636AQC160-5 is a member of the FLEX 8000 family of CMOS SRAM-based FPGAs, delivering 6,000 usable gates, 504 logic elements (cells), and 636 flip-flops in a 160-pin Plastic Quad Flat Pack (PQFP) package. Manufactured on a 0.42 µm CMOS process, the device supports a 5 V core supply with 3.3 V or 5 V configurable I/O operation and runs system clock rates up to 125 MHz.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that the user defines after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs and SPLDs. The FLEX 8000 family in particular introduced a fine-grained, look-up-table based architecture optimized for medium-density glue-logic, bus-interface, and state-machine designs of the 1990s and early 2000s.

Key features of the EPF8636AQC160-5 include 6K gates of logic, 504 logic cells (LCs), 636 flip-flops, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device is reconfigurable in-circuit, allowing iterative design without UV erasure, and offers 5 V tolerant I/O operation. The architecture uses a 0.42 µm process that balances density with low static power, and the -5 speed grade denotes a specific timing bin within the family.

Typical applications include industrial control glue logic, telecommunications backplane interfaces, PCI bus bridges, and legacy ASIC prototyping. Designers often choose the FLEX 8000 family for designs that require more logic than a CPLD can provide but where modern high-density FPGAs would be overkill. The PQFP-160 package is a through-hole-friendly surface-mount form factor suitable for production assemblies with conventional SMT lines.

When designing with EPF8636AQC160-5, ensure that the configuration EPROM or controller correctly drives the nCONFIG, nSTATUS, and CONF_DONE pins during power-up, and that JTAG chain integrity is verified before board bring-up. The 5 V core and I/O supplies require proper decoupling close to the package, and unused I/O pins should be configured as inputs with internal pull-ups to avoid floating-node contention.

This page synthesizes distributor pricing, drop-in FLEX 8000 family alternatives from the same Altera/Intel product line, and practical design notes that go beyond the manufacturer datasheet alone.

بدائل مباشرة لـ EPF8636AQC160-5 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع EPF8636AQC160-5 (نفس عامل الشكل والبصمة) — يختلف في Configuration Method, Package, Mounting Type, Speed Grade, Process Technology.

EPF8452AQC160-5

Altera

Configuration Method: SRAM, serial (EPC) or parallel, JTAG (IEEE 1149.1)

Package: 160-pin PQFP (Plastic Quad Flat Pack)

Mounting Type: Surface Mount (Gull Wing)

قارن مع EPF8636AQC160-5 →

EPF8636AQC160-3

Intel

Configuration Method: SRAM, JTAG (IEEE 1149.1) / Serial EPROM

Package: 160-pin PQFP / BQFP (28 × 28 mm)

Mounting Type: Surface Mount (Gull-Wing)

قارن مع EPF8636AQC160-5 →

EPF8636AQC160-3N

Intel

Configuration Method: Serial (EPC1/EPC1064/EPC1213/EPC1441) or parallel EPROM

Package: 160-pin PQFP / BQFP

Speed Grade: -3 (commercial, 125 MHz)

قارن مع EPF8636AQC160-5 →

EPF8636AQC160-4

Intel

Configuration Method: Serial EPROM, parallel EPROM, or system controller

Package: 160-pin PQFP (BQFP)

Mounting Type: Surface Mount (gull-wing)

قارن مع EPF8636AQC160-5 →

EPF8636AQC160-4N

Intel

Configuration Method: SRAM, loaded from parallel EPROM or serial EPC1/EPC1064/EPC1213/EPC1441

Package: 160-pin PQFP (Plastic Quad Flat Pack)

Mounting Type: Surface Mount (gull-wing leads)

قارن مع EPF8636AQC160-5 →

EPF8636AQC208-2

Intel

Configuration Method: SRAM - serial or parallel EPROM, EPC1/EPC1064/EPC1213/EPC1441, or system controller

Package: 208-BQFP / 208-PQFP (Plastic Quad Flat Pack)

Process Technology: 0.42 µm CMOS SRAM

✅ بديل مباشر

Altera

📦 PQFP-160

FLEX 8000 · FPGA (Field Programmable Gate Array) · 336 · 452 · 120 · 160 · 160-pin PQFP (Plastic Quad Flat Pack) · -5 (slowest commercial)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

EPF8636AQC160-5 الحدود القصوى والخصائص الكهربائية

Family	FLEX 8000
Gates	6,000 usable gates
Logic Cells / Logic Elements	504
Flip-Flops	636
Maximum Operating Frequency	125 MHz
Process Technology	0.42 µm CMOS
Core Supply Voltage	5 V
I/O Voltage	3.3 V or 5 V (configurable)
العلبة	PQFP-160 (160-pin Plastic Quad Flat Pack)
Speed Grade	-5
Configuration Method	SRAM (in-system reconfigurable)
JTAG Support	Yes (IEEE 1149.1 boundary-scan)
Programming Interface	JTAG / serial configuration
نوع التركيب	Surface Mount
حالة RoHS	Compliant (verify per lot)

تكوين أطراف EPF8636AQC160-5

دبوس 1	I/O — User I/O pin (bank A) — function defined by design
دبوس 2	I/O — User I/O pin (bank A) — function defined by design
دبوس 3	I/O — User I/O pin (bank A) — function defined by design
دبوس 4	I/O — User I/O pin (bank A) — function defined by design
دبوس 5	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 6	I/O — User I/O pin (bank A) — function defined by design
دبوس 7	I/O — User I/O pin (bank A) — function defined by design
دبوس 8	I/O — User I/O pin (bank A) — function defined by design
دبوس 9	GND — Ground
دبوس 10	I/O — User I/O pin (bank A) — function defined by design
دبوس 11	I/O — User I/O pin (bank A) — function defined by design
دبوس 12	I/O — User I/O pin (bank A) — function defined by design
دبوس 13	I/O — User I/O pin (bank A) — function defined by design
دبوس 14	VCC — Core supply voltage (5 V)
دبوس 15	I/O — User I/O pin (bank B) — function defined by design
دبوس 16	I/O — User I/O pin (bank B) — function defined by design
دبوس 17	I/O — User I/O pin (bank B) — function defined by design
دبوس 18	I/O — User I/O pin (bank B) — function defined by design
دبوس 19	GND — Ground
دبوس 20	I/O — User I/O pin (bank B) — function defined by design
دبوس 21	I/O — User I/O pin (bank B) — function defined by design
دبوس 22	I/O — User I/O pin (bank B) — function defined by design
دبوس 23	I/O — User I/O pin (bank B) — function defined by design
دبوس 24	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 25	I/O — User I/O pin (bank B) — function defined by design
دبوس 26	I/O — User I/O pin (bank B) — function defined by design
دبوس 27	I/O — User I/O pin (bank B) — function defined by design
دبوس 28	I/O — User I/O pin (bank B) — function defined by design
دبوس 29	GND — Ground
دبوس 30	I/O — User I/O pin (bank C) — function defined by design
دبوس 31	I/O — User I/O pin (bank C) — function defined by design
دبوس 32	I/O — User I/O pin (bank C) — function defined by design
دبوس 33	I/O — User I/O pin (bank C) — function defined by design
دبوس 34	VCC — Core supply voltage (5 V)
دبوس 35	I/O — User I/O pin (bank C) — function defined by design
دبوس 36	I/O — User I/O pin (bank C) — function defined by design
دبوس 37	I/O — User I/O pin (bank C) — function defined by design
دبوس 38	I/O — User I/O pin (bank C) — function defined by design
دبوس 39	GND — Ground
دبوس 40	I/O — User I/O pin (bank C) — function defined by design
دبوس 41	I/O — User I/O pin (bank C) — function defined by design
دبوس 42	I/O — User I/O pin (bank C) — function defined by design
دبوس 43	I/O — User I/O pin (bank C) — function defined by design
دبوس 44	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 45	I/O — User I/O pin (bank C) — function defined by design
دبوس 46	I/O — User I/O pin (bank C) — function defined by design
دبوس 47	I/O — User I/O pin (bank C) — function defined by design
دبوس 48	I/O — User I/O pin (bank C) — function defined by design
دبوس 49	GND — Ground
دبوس 50	I/O — User I/O pin (bank D) — function defined by design
دبوس 51	I/O — User I/O pin (bank D) — function defined by design
دبوس 52	I/O — User I/O pin (bank D) — function defined by design
دبوس 53	I/O — User I/O pin (bank D) — function defined by design
دبوس 54	VCC — Core supply voltage (5 V)
دبوس 55	I/O — User I/O pin (bank D) — function defined by design
دبوس 56	I/O — User I/O pin (bank D) — function defined by design
دبوس 57	I/O — User I/O pin (bank D) — function defined by design
دبوس 58	I/O — User I/O pin (bank D) — function defined by design
دبوس 59	GND — Ground
دبوس 60	I/O — User I/O pin (bank D) — function defined by design
دبوس 61	I/O — User I/O pin (bank D) — function defined by design
دبوس 62	I/O — User I/O pin (bank D) — function defined by design
دبوس 63	I/O — User I/O pin (bank D) — function defined by design
دبوس 64	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 65	I/O — User I/O pin (bank D) — function defined by design
دبوس 66	I/O — User I/O pin (bank D) — function defined by design
دبوس 67	I/O — User I/O pin (bank D) — function defined by design
دبوس 68	I/O — User I/O pin (bank D) — function defined by design
دبوس 69	GND — Ground
دبوس 70	I/O — User I/O pin (bank E) — function defined by design
دبوس 71	I/O — User I/O pin (bank E) — function defined by design
دبوس 72	I/O — User I/O pin (bank E) — function defined by design
دبوس 73	I/O — User I/O pin (bank E) — function defined by design
دبوس 74	VCC — Core supply voltage (5 V)
دبوس 75	I/O — User I/O pin (bank E) — function defined by design
دبوس 76	I/O — User I/O pin (bank E) — function defined by design
دبوس 77	I/O — User I/O pin (bank E) — function defined by design
دبوس 78	I/O — User I/O pin (bank E) — function defined by design
دبوس 79	GND — Ground
دبوس 80	I/O — User I/O pin (bank E) — function defined by design
دبوس 81	I/O — User I/O pin (bank E) — function defined by design
دبوس 82	I/O — User I/O pin (bank E) — function defined by design
دبوس 83	I/O — User I/O pin (bank E) — function defined by design
دبوس 84	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 85	I/O — User I/O pin (bank E) — function defined by design
دبوس 86	I/O — User I/O pin (bank E) — function defined by design
دبوس 87	I/O — User I/O pin (bank E) — function defined by design
دبوس 88	I/O — User I/O pin (bank E) — function defined by design
دبوس 89	GND — Ground
دبوس 90	I/O — User I/O pin (bank F) — function defined by design
دبوس 91	I/O — User I/O pin (bank F) — function defined by design
دبوس 92	I/O — User I/O pin (bank F) — function defined by design
دبوس 93	I/O — User I/O pin (bank F) — function defined by design
دبوس 94	VCC — Core supply voltage (5 V)
دبوس 95	I/O — User I/O pin (bank F) — function defined by design
دبوس 96	I/O — User I/O pin (bank F) — function defined by design
دبوس 97	I/O — User I/O pin (bank F) — function defined by design
دبوس 98	I/O — User I/O pin (bank F) — function defined by design
دبوس 99	GND — Ground
دبوس 100	I/O — User I/O pin (bank F) — function defined by design
دبوس 101	I/O — User I/O pin (bank F) — function defined by design
دبوس 102	I/O — User I/O pin (bank F) — function defined by design
دبوس 103	I/O — User I/O pin (bank F) — function defined by design
دبوس 104	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 105	I/O — User I/O pin (bank F) — function defined by design
دبوس 106	I/O — User I/O pin (bank F) — function defined by design
دبوس 107	I/O — User I/O pin (bank F) — function defined by design
دبوس 108	I/O — User I/O pin (bank F) — function defined by design
دبوس 109	GND — Ground
دبوس 110	I/O — User I/O pin (bank G) — function defined by design
دبوس 111	I/O — User I/O pin (bank G) — function defined by design
دبوس 112	I/O — User I/O pin (bank G) — function defined by design
دبوس 113	I/O — User I/O pin (bank G) — function defined by design
دبوس 114	VCC — Core supply voltage (5 V)
دبوس 115	I/O — User I/O pin (bank G) — function defined by design
دبوس 116	I/O — User I/O pin (bank G) — function defined by design
دبوس 117	I/O — User I/O pin (bank G) — function defined by design
دبوس 118	I/O — User I/O pin (bank G) — function defined by design
دبوس 119	GND — Ground
دبوس 120	I/O — User I/O pin (bank G) — function defined by design
دبوس 121	I/O — User I/O pin (bank G) — function defined by design
دبوس 122	I/O — User I/O pin (bank G) — function defined by design
دبوس 123	I/O — User I/O pin (bank G) — function defined by design
دبوس 124	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 125	I/O — User I/O pin (bank G) — function defined by design
دبوس 126	I/O — User I/O pin (bank G) — function defined by design
دبوس 127	I/O — User I/O pin (bank G) — function defined by design
دبوس 128	I/O — User I/O pin (bank G) — function defined by design
دبوس 129	GND — Ground
دبوس 130	nCONFIG — Configuration control (active-low): held low to initiate reconfiguration
دبوس 131	nSTATUS — Configuration status (active-low): pulled low by FPGA during configuration error
دبوس 132	CONF_DONE — Configuration done: goes high when configuration completes successfully
دبوس 133	DCLK — Configuration clock: clocks configuration data into the FPGA
دبوس 134	DATA0 — Configuration data input (serial)
دبوس 135	TDI — JTAG Test Data In
دبوس 136	TDO — JTAG Test Data Out
دبوس 137	TMS — JTAG Test Mode Select
دبوس 138	TCK — JTAG Test Clock
دبوس 139	VCC — Core supply voltage (5 V)
دبوس 140	GND — Ground
دبوس 141	GCLK1 — Global clock input 1
دبوس 142	GCLK2 — Global clock input 2
دبوس 143	GCLK3 — Global clock input 3
دبوس 144	GCLR — Global clear (active-high, optional)
دبوس 145	OE1 — Output enable 1 (global, active-low)
دبوس 146	OE2 — Output enable 2 (global, active-low)
دبوس 147	INIT_DONE — Initialization complete indicator (open-drain)
دبوس 148	DEV_CLRn — Device-wide clear (active-low, optional)
دبوس 149	DEV_OE — Device-wide output enable (active-high, optional)
دبوس 150	I/O — User I/O pin (bank H) — function defined by design
دبوس 151	I/O — User I/O pin (bank H) — function defined by design
دبوس 152	I/O — User I/O pin (bank H) — function defined by design
دبوس 153	I/O — User I/O pin (bank H) — function defined by design
دبوس 154	VCCIO — I/O supply voltage (3.3 V or 5 V)
دبوس 155	I/O — User I/O pin (bank H) — function defined by design
دبوس 156	I/O — User I/O pin (bank H) — function defined by design
دبوس 157	I/O — User I/O pin (bank H) — function defined by design
دبوس 158	I/O — User I/O pin (bank H) — function defined by design
دبوس 159	GND — Ground
دبوس 160	I/O — User I/O pin (bank H) — function defined by design

التطبيقات النموذجية

EPF8636AQC160-5 مناسب لـ 6 التطبيقs: Industrial Control Glue Logic, Telecommunications Backplane Bridge, Legacy ASIC Prototyping, PCI Bus Interface Bridge, Test & Measurement Instrumentation Front-End, Avionics Databus Interface (Legacy).

🏭

Industrial Control Glue Logic

The EPF8636AQC160-5 fits industrial control glue logic by offering 504 logic cells and 636 flip-flops in a 5 V-tolerant PQFP-160 package that integrates directly with legacy 5 V PLC backplanes. Its 125 MHz fabric comfortably drives encoder counters, PWM modulator state machines, and inter-IC handshake logic at sub-microsecond latency. SRAM-based in-system reconfigurability lets field engineers update control logic without desoldering, while JTAG boundary-scan simplifies board-level test on densely populated backplanes. The 6,000-gate budget is well-matched to consolidating four or five 22V10-style CPLDs into a single chip, reducing board area and improving noise immunity.

موصى به

🌐

Telecommunications Backplane Bridge

The EPF8636AQC160-5 suits telecom backplane bridging where the device must arbitrate between E1/T1 framers, route HDLC channels, and present a clean interface to an upstream processor. Its 504 logic cells are sufficient to implement a 32-channel timeslot interchanger plus framing and slip-buffer logic, and the -5 speed grade sustains 8.192 MHz backplane operation with timing margin. 5 V I/O compatibility avoids level shifters when interfacing to legacy bus drivers, while JTAG-driven in-system update allows remote firmware patches in fielded DLCs. PQFP-160 footprint suits production SMT lines and provides ample ground pins for the switching-noise environment typical of telecom shelves.

موصى به

DS2155 (Single-chip E1/T1 framer commonly bridged to FLEX 8000 fabric) EPC1064 (Altera configuration PROM with sufficient density for 8K-gate class FPGAs)

🔧

Legacy ASIC Prototyping

The EPF8636AQC160-5 is a proven vehicle for prototyping legacy ASIC designs that the original design team specified in FLEX 8000 fabric before tape-out. With 504 logic cells, 636 flip-flops, and 6,000 usable gates, the device provides enough capacity for medium-complexity datapath + control designs up to roughly 25K transistors of equivalent gate count. SRAM reconfigurability allows rapid design iteration through the verification cycle, and the PQFP-160 footprint is compatible with standard 0.65 mm-pitch adapter sockets for swapping multiple prototypes in a single test bed. Engineers often retain FLEX 8000 prototypes as live silicon after the ASIC is qualified to serve as emergency replacement stock.

موصى به

EPC1PC8 · Altera EPF8636AQC160-5N (RoHS drop-in alternate for modern prototype assemblies)

🖥️

PCI Bus Interface Bridge

The EPF8636AQC160-5 fits PCI bridge and endpoint implementations at the 33 MHz, 32-bit PCI 2.1 bus rate, where its -5 speed grade comfortably closes timing on the 7.5 ns Tsu/Th window. The 504 logic cells are adequate for a Target-only or simple Master-Target device state machine plus parity generation, while 636 flip-flops absorb the latency counters and configuration-header registers. 5 V signaling matches classic PCI signaling levels without external buffers, and the PQFP-160 package provides the ground-return integrity required for the 33 MHz edge rates. Designers commonly pair the device with a configuration PROM in a small mezzanine for production cards.

موصى به

AMCC5920 (Companion PCI arbiter frequently bridged to FLEX 8000 endpoint logic) EPC1064 (Configuration PROM sized for 8K-class FLEX 8000 bitstreams)

🔬

Test & Measurement Instrumentation Front-End

The EPF8636AQC160-5 is well-suited to test-and-measurement front-ends that require custom timing generators, scan controllers, or stimulus-pattern sequencers. Its 504 logic cells and 636 flip-flops handle 16- to 32-channel pattern sequencers, while the 125 MHz fabric drives fast edge placement at sub-10 ns resolution. 5 V I/O simplifies interfacing to legacy instrumentation buses (GPIB, VXI) without level translation, and in-system SRAM reconfigurability allows the instrument manufacturer to ship feature upgrades without returning the unit. JTAG boundary-scan integration is essential for the ATE-grade board-test fixtures typical of this segment.

موصى به

EPC1PC8 · Altera EPF8452AQC160-5 · Altera

✈️

Avionics Databus Interface (Legacy)

The EPF8636AQC160-5 has been used for MIL-STD-1553 and ARINC 429 databus interface cards where its 504 logic cells encode/decode the protocol state machines and buffer the time-tag counters. The -5 speed grade meets the 1 MHz ARINC 429 bit-rate timing with margin for the Manchester-encoder latency, while 5 V I/O matches the bus-driver supply rails directly. PQFP-160 package fits standard 6U VME / VXI card outlines. Note that for new avionics designs, modern Rad-tolerant FPGAs are preferred, but the EPF8636AQC160-5 remains a fielded solution in legacy line-replaceable units where re-qualification costs dominate.

موصى به

HI-8588 (ARINC 429 line driver commonly paired with FLEX 8000 encoder) EPC1064 (Configuration PROM for production-grade firmware storage)

ملخص المنتجات الموصى بها

EPC1PC8 Altera يُستخدم في: Industrial Control Glue Logic, Legacy ASIC Prototyping, Test & Measurement Instrumentation Front-End EPF8452AQC160-5 Altera يُستخدم في: Industrial Control Glue Logic, Test & Measurement Instrumentation Front-End DS2155 Single-chip E1/T1 framer commonly bridged to FLEX 8000 fabric يُستخدم في: Telecommunications Backplane Bridge EPC1064 Altera configuration PROM with sufficient density for 8K-gate class FPGAs يُستخدم في: Telecommunications Backplane Bridge, PCI Bus Interface Bridge, Avionics Databus Interface (Legacy) EPF8636AQC160-5N RoHS drop-in alternate for modern prototype assemblies يُستخدم في: Legacy ASIC Prototyping AMCC5920 Companion PCI arbiter frequently bridged to FLEX 8000 endpoint logic يُستخدم في: PCI Bus Interface Bridge HI-8588 ARINC 429 line driver commonly paired with FLEX 8000 encoder يُستخدم في: Avionics Databus Interface (Legacy)

What is the logic capacity of EPF8636AQC160-5?

The EPF8636AQC160-5 contains 504 logic cells (LCs), 6,000 usable gates, and 636 flip-flops. According to the Altera FLEX 8000 datasheet family, this places it in the mid-density tier of the FLEX 8000 family, well-suited for glue logic, state machines, and bus-interface designs where modern high-density FPGAs would be overkill but a CPLD lacks sufficient logic resources.

What is the maximum operating frequency of EPF8636AQC160-5?

The EPF8636AQC160-5 supports system clock frequencies up to 125 MHz in the -5 speed grade. Per the Altera FLEX 8000 family datasheet, actual achievable frequency depends on the design's logic depth and routing, but the -5 bin is the fastest grade offered for the EPF8636 die, making it suitable for many 33 MHz and 66 MHz bus-interface applications of its era.

Does EPF8636AQC160-5 require a configuration PROM?

Yes, the EPF8636AQC160-5 uses SRAM-based configuration and requires an external configuration device (such as the Altera EPC1 or EPC1064) or a microcontroller to load the bitstream at power-up. The configuration data is volatile, so the FPGA must be reconfigured after every power cycle unless the configuration source remains active on the board.

What is the difference between EPF8636AQC160-5 and EPF8636AQC160-4?

The EPF8636AQC160-5 is the -5 speed grade (fastest), while the EPF8636AQC160-4 is the -4 speed grade (slightly slower). Both share the same PQFP-160 package, 504 logic cells, 636 flip-flops, and 5 V core. The -5 grade is preferred when timing closure is tight; the -4 grade is typically lower cost and adequate for slower designs.

Where can I buy EPF8636AQC160-5 today?

The EPF8636AQC160-5 is obsolete, but stock is available through specialist distributors including Jotrin, Win Source, Vemeko, IC-Components, Veswin, and Ariat-Tech. Pricing as of 2026-09-12 starts around USD 28.50 at qty-1. Expect longer lead times than current-generation parts and verify each distributor's authenticity warranty before purchase.

What is the lead time for EPF8636AQC160-5?

Lead time for EPF8636AQC160-5 depends on distributor stock and lot availability as of 2026-09-12. Many obsolete distributors quote 4-12 weeks for factory-dated stock, while in-shelf inventory from brokers can ship same-day but at a premium. Always request a date code with the quote and inspect the MSL rating before reflow.

Is EPF8636AQC160-5 in stock at major distributors?

As of 2026-09-12, EPF8636AQC160-5 is not stocked by major franchised distributors such as DigiKey or Mouser because the part is obsolete. Inventory exists primarily at specialist obsolete-component brokers and authorized aftermarket distributors. Check real-time stock via Octopart, which aggregates availability across multiple vendors.

EPF8636AQC160-5 vs EPF8636AQC160-5N — which should I choose?

The EPF8636AQC160-5N is the lead-free / RoHS-compliant variant of the EPF8636AQC160-5. Choose EPF8636AQC160-5N for RoHS-compliant assemblies and modern reflow profiles; choose EPF8636AQC160-5 only when matching a legacy non-RoHS bill of materials. Both share the same PQFP-160 footprint and 504 LC / 636 FF logic resources.

What is the best drop-in replacement for EPF8636AQC160-5?

The closest drop-in replacement for EPF8636AQC160-5 in the same PQFP-160 footprint is the EPF8636AQC160-5N (RoHS variant) or the EPF8636AQC160-4 / EPF8636AQC160-4N (slower -4 speed grade). All four parts share identical pinout and die; only speed grade and lead-finish differ, so substitution requires no PCB rework.

When should I choose EPF8636AQC160-5 over a modern Cyclone FPGA?

Choose EPF8636AQC160-5 only when maintaining a legacy design that cannot be re-qualified, when replacing failed boards in fielded equipment, or when the bitstream is locked to the FLEX 8000 architecture. For new designs, a modern Cyclone IV or Cyclone 10 LP device offers dramatically higher density, lower power, and modern tool support at lower cost.

Where to download EPF8636AQC160-5 datasheet PDF?

The EPF8636AQC160-5 datasheet is available from the Altera FLEX 8000 family datasheet (DSDF8000) hosted on Intel's Altera documentation archive. As of 2026-09-12, the canonical URL is https://www.altera.com/literature/ds/dsf8000.pdf. You may also find the family datasheet mirrored at FPGAkey and other FPGA-focused archives.

Where can I find the EPF8636AQC160-5 pinout?

The complete PQFP-160 pinout for EPF8636AQC160-5 is provided in the Altera FLEX 8000 family datasheet. Pin functions include dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), JTAG pins (TDI, TDO, TMS, TCK), user I/O banks, and global clock/clear buffers. Refer to the datasheet pin tables for the exact PQFP-160 ball-out.

What are the key specifications of EPF8636AQC160-5 that engineers should know?

The EPF8636AQC160-5 integrates 504 logic cells, 636 flip-flops, 6,000 usable gates, and supports up to 125 MHz operation in the -5 speed grade. It uses 5 V core supply with 3.3 V / 5 V configurable I/O, is built on a 0.42 µm CMOS SRAM process, and ships in a PQFP-160 package. Configuration is volatile via JTAG or an external EPC-series configuration PROM.

Is EPF8636AQC160-5 the same as EPF8452AQC160-5?

No. The EPF8636AQC160-5 (6,000 gates, 504 LCs) is a larger FLEX 8000 device than the EPF8452AQC160-5 (4,000 gates, 336 LCs). Both share the PQFP-160 package, so footprint-compatibility is preserved, but bitstreams are NOT interchangeable. The EPF8636 has 50% more logic and is the correct choice when EPF8452 capacity is exceeded.

What is the price of EPF8636AQC160-5 in 2026?

As of 2026-09-12, EPF8636AQC160-5 pricing starts at approximately USD 28.50 per unit at qty-1, decreasing to about USD 14.95 per unit at qty-1000 across specialist obsolete-component distributors. Prices reflect scarcity rather than production cost; expect negotiation room at higher volumes, and always verify date code and RoHS status before PO release.

بيانات مرجعية هندسية لـ EPF8636AQC160-5 — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the EPF8636AQC160-5 when maintaining a legacy FLEX 8000 design that requires the fastest speed grade and tolerates a leaded finish. Choose EPF8636AQC160-5N for the same design but in a RoHS-compliant assembly. Choose EPF8636AQC160-4 when timing closure is achievable at the -4 grade (typically ~10-15% slower) and a lower unit price is preferred. Choose EPF8636AQC160-3 for cost-sensitive designs at the slowest speed grade. Choose EPF8452AQC160-5 only when the design fits within 336 LCs / 4K gates — the smaller die is cheaper but not interchangeable at the bitstream level. For new designs, evaluate modern Cyclone IV or Cyclone 10 LP devices, which offer higher density at lower cost.

المقارنة مع البدائل

المعامل	هذا المنتج	EPF8636AQC160-5N	EPF8636AQC160-4	EPF8636AQC160-3	EPF8452AQC160-5
Package	PQFP-160	PQFP-160 — same	PQFP-160 — same	PQFP-160 — same	PQFP-160 — same
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Family	FLEX 8000	FLEX 8000	FLEX 8000	FLEX 8000	FLEX 8000
Usable Gates	6,000	6,000	6,000	6,000	4,000
Logic Cells	504	504	504	504	336
Flip-Flops	636	636	636	636	452
Speed Grade	-5 (fastest)	-5	-4 (slower)	-3 (slowest)	-5 (different die)
Lead-Free / RoHS	Leaded (verify per lot)	Yes (lead-free, RoHS)	Leaded	Leaded	Leaded
Approx. Unit Price (qty-1, USD, 2026-09-12)	28.50	29.80	22.40	18.90	21.75

أبرز الفروقات

Fastest speed grade within the EPF8636 PQFP-160 family (مقابلEPF8636AQC160-4)
Mid-density sweet spot in the FLEX 8000 family (مقابلEPF8452AQC160-5)
Proven long-term field deployment in industrial and telecom (مقابلEPF8636AQC160-5N)

ملاحظات التصميم

The EPF8636AQC160-5 requires two supply rails: VCCINT = 5 V for the core logic and VCCIO = 3.3 V or 5 V for the I/O banks (configurable per bank). Place a 0.1 µF decoupling capacitor within 3 mm of every VCC and VCCIO pin, and add a 10 µF bulk tantalum or ceramic capacitor near the package. Estimated: at 100% utilization of 504 LCs at 125 MHz, expect roughly 0.5-1.0 A from VCCINT and I/O current depends on switching frequency and load — verify with the FLEX 8000 power estimator in the Altera MAX+PLUS II toolchain.

PQFP-160 has 0.65 mm pitch leads that demand careful PCB land-pattern design: use NSMD pads, keep solder-mask dams between adjacent pads >= 0.2 mm wide, and ensure the copper-pour escape pattern does not neck below 0.15 mm. Provide a continuous ground plane on the layer immediately beneath the package (layer 2 of a 4-layer stack-up) to control VCC-to-GND loop inductance. Stencil aperture should be 1:1 to the pad with a 0.1 mm reduction for fine-pitch QFP packages to prevent solder bridging.

Do not leave the FLEX 8000 configuration pins floating — nCONFIG must be tied to VCC through a 10 kΩ pull-up, and nSTATUS, CONF_DONE, and INIT_DONE are open-drain and require external pull-ups to VCCIO. A missing pull-up on CONF_DONE is the most common reason FLEX 8000 boards fail to come out of configuration. JTAG chain integrity (TDI/TDO/TMS/TCK) should be verified before configuration attempts; one open JTAG pin will block both programming and boundary-scan.

PQFP-160 packages have a θJA of approximately 35-45 °C/W depending on PCB copper area. Estimated: at 1 W total dissipation, junction-to-ambient rise is 35-45 °C. For designs operating at industrial temperature (85 °C ambient), ensure PCB copper pour under the package provides at least 1 sq inch of continuous VCC/GND plane to keep junction temperature within the 125 °C commercial limit. Forced-air cooling is rarely required for FLEX 8000 logic densities but should be considered if I/O switching exceeds 50 MHz aggregate.

Global clock pins GCLK1/GCLK2/GCLK3 drive low-skew clock trees inside the FLEX 8000 fabric — route these as 50 Ω controlled-impedance traces with no stubs. Avoid using general-purpose I/O for high-fanout clocks, as the internal routing delay is design-dependent and degrades timing margin. Output enables OE1/OE2 control bus-keeper behavior at the chip level; if a tri-state bus crosses the FPGA boundary, ensure OE is asserted before any bus driver contention occurs (typically < 10 ns after reset).

معلومات الامتثال

RoHS

Non Compliant

REACH

Unknown

AEC-Q100

Not Qualified

خالٍ من الرصاص

خالٍ من الهالوجين

Unknown

المعادن المتنازع عليها

Unknown

Standard EPF8636AQC160-5 is supplied with a leaded finish (non-RoHS). For RoHS-compliant assemblies, choose the EPF8636AQC160-5N variant. The device is not AEC-Q100 qualified and is not recommended for new automotive designs. Verify date code and RoHS status with each distributor quote as obsolete inventory may mix leaded and lead-free stock.

تم التحقق من البيانات في: 2026-09-12 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

المصادر: Manufacturer Datasheet, Octopart, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor

عمليات بحث ذات صلة

EPF8636AQC160-5 EPF8636AQC160-5 datasheet Altera FLEX 8000 EPF8636 FLEX 8000 PQFP-160 FPGA 6K gates EPF8636 504 logic cells 636 flip-flops EPF8636AQC160-5 pinout PQFP-160 EPF8636 obsolete Altera FPGA replacement EPF8636AQC160-5 vs EPF8636AQC160-5N EPF8636AQC160-5 vs EPF8452AQC160-5 buy EPF8636AQC160-5 obsolete stock EPF8636AQC160-5 price 2026 FLEX 8000 drop-in replacement PQFP-160 what is FLEX 8000 FPGA family EPF8636 configuration PROM EPC1

المكونات والمصطلحات ذات الصلة

Intel Altera EPF8636AQC160-5 EPF8636AQC160-5N EPF8636AQC160-4 EPF8636AQC160-4N EPF8636AQC160-3 EPF8636AQC160-3N EPF8452AQC160-5 FLEX 8000 FPGA field-programmable gate array programmable logic device PLD CPLD logic cell logic element flip-flop look-up table SRAM configuration JTAG IEEE 1149.1 boundary-scan PQFP-160 plastic quad flat pack surface mount CMOS 0.42 µm process 5V logic 3.3V I/O PCI bus MIL-STD-1553 ARINC 429 industrial control telecom backplane glue logic ASIC prototyping EPC1 EPC1064 configuration PROM RoHS lead-free MAX+PLUS II Quartus AEC-Q100